Used EVG / EV GROUP 6200 Infinity #9189343 for sale
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ID: 9189343
Bond aligner, 8"
Wafer to wafer aligner: Subsequent wafer bonding applications
General:
Software adjustable
Wafer separation distance: 0 - 300 μm
Wafer thickness: 0.1 - 4.4 mm
Total stack thickness: 4.5 mm
Semi automatic loading with mechanical prealignment
Quick change of chuck
Automatic pressure
Vacuum transfer
Alignment accuracy: ± 1μm
High process objectives
NRTL Listing mark: UL STD 61010A-1
Storage rack: (5) Aligner tools
Software:
MS-Windows
PC Controlled operating environment
Self explaining commands
Remote diagnostics1
Software for bond alignment:
Recipe parameters
User guidance
Optical alignment: (2) Wafers
Silicon direct bonding (SDB)
Substrate configurations: Si+Glass, Si+Si
Subsequent anodic
Thermo-compression
Fusion bonding processes: EVG 500 series bond system
Nanoalign technology package:
High performance frame grabber running
COGNEX PatMax vision software technology
Increases EVG aligner microscope resolution: Factor ~2
Image quality: 100 % Digital signal processing
Key identification feature: Multi layer alignment key design
Scaled (Over / Under etched) alignment keys
Enhanced digital zoom capabilities
Crosshair mode: Standard backside alignment processes
Alignment stage motorized:
Alignment stage: X, Y, theta, Z
Joystick alignment: Via (3) axes
DC Motor controllers: Cursor key fine alignment
Automatic wedge compensation system: Optimized print gap control
WEC Contact force: 0.5 - 40 N adjustable
Shift between mask and wafer: No
Automatic alignment for top / bottom side:
Vision system (Integrated in PC)
Storage:
Trained mask
Substrate patterns on hard disk
Software integrated in EVG 6200 computer controller
Alignment marks: Top / Bottom side alignment
Alignment results:
Process conditions
Material properties
Bottom side microscope:
Motorized splitfield microscopes
Visible light with high resolution CCD cameras
Digitized alignment keys (Mask) / Cross hair
Travel range:
X: 78 mm - 180 mm
Y: ± 12 mm
(2) Objectives: 5x (3.6x - 20x)
Objective: 3.6x:
Field of view per objective: ~ 1.5 mm x 1 mm
Rack unit:
Integrates EVG 6200 system
Operating elements
Monitor vibration isolated
Prepared for robotic auto load system
Bond tool universal, 8":
Anodic
Thermo compression
Silicon direct bonding process
Bond chuck with mechanical clamping
Loading chuck
Separation flags
Currently warehoused
2008 vintage.
EVG / EV GROUP 6200 Infinity is a mask aligner designed to help fabricate and analyze complex miniature optical devices in a more efficient manner. EVG 6200 Infinity integrates patented mask and wafer stages with software to create highly repeatable and precise alignment to processes. It is comprised of fully automated alignment systems with integrated imaging and automated recipes to help streamline the overall process. EV GROUP 6200 Infinity features advanced features such as optimized positioning for two substrates with top- and bottom-side imaging, a fully automated setup and execution of a wide range of processes, and capability to create a variety of imaging systems. 6200 Infinity offers precise and accurate alignment, particularly with optical processes. It aligns reference points across two substrates, ensuring precise registration and repeatability, even with small structures or multiple orientations. It also features a patented 0.3-micron resolution alignment equipment with a state-of-the-art optical system that can accurately detect sub-micron features and show precise alignment of features within a single or two-substrate applications. Additionally, EVG / EV GROUP 6200 Infinity offers improved operating speed, allowing users to produce in-process optimization data in the shortest amount of time. EVG 6200 Infinity is further equipped with a wafer chucking at the center of the unit to provide long-term stability even with higher temperature conditions. It also features expanded motion capabilities, allowing all axes of motion to be customized, including XYZ/φ/Z, XYZ/ICH/DCN, XYZ/E/PN, and XYZ/V/CN. In addition, the machine offers a variety of throughput optimizers to accommodate high-volume yields, as well as a wide range of assistive technology to further reduce overall costs while increasing accuracy and repeatability. EV GROUP 6200 Infinity is indeed a modern mask aligner that provides users with precise and repeatable alignment capabilities, along with increased operating speed and accuracy. This makes it an ideal solution for creating complex miniature optical devices that require high levels of accuracy and repeatability.
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