Used EVG / EV GROUP EV 501 #9316049 for sale

EVG / EV GROUP EV 501 is a fully automated wafer bonding machine that is used for assembling devices or components. This machine offers optimal accuracy, precise control, low cost of ownership, and a small footprint, ideal for laboratories and production facilities. EVG EV 501 is designed with a large, easy-to-read display that allows for precise control of its functions. This display also features interactive menus for quick setup and can store up to 30 of the most frequently used bonding recipes. The machine uses an intuitive, graphical user interface for easy navigation of the various settings. Furthermore, a built-in vision system provides real-time feedback to help optimize the process parameters. The machine's advanced hardware includes high power pulse generators as well as a unidirectional, thermopneumatic cab module. The pulse generators provide precise pressure bonding of components, while the cab module facilitates flipping and accurate alignment of parts. EV GROUP EV 501 also features an automatic two-dimensional stage for alignment with the help of an integrated laser scanner. In addition, the machine comes with a full set of interface accessories, enabling a wide range of operations such as Cassette-to-Cassette (CBC) automation, front-end sample delivery, Wafer-to-Wafer (W2W) automation, and both Cross-Slot and Corner-Turn (CT/TC) bond modifications. This gives EV 501 extraordinary flexibility to create all types of bonded device configurations. EVG / EV GROUP EV 501 is capable of handling wafer sizes up to 200mm, making it suitable for applications ranging from MEMS devices to 5G wireless applications. It includes heavily shielded housing for protection against electrostatic discharge (ESD) as well as other safety features ensuring reliable and safe wafer bonding. Finally, the widespread availability of consumables, such as bond frames and evaporation holes, make maintenance and replacement simpler and more cost-effective. In summary, EVG EV 501 is a fully automated, precision wafer bonding machine that is designed to meet the requirements of high reliability and cost-effectiveness. Its best-in-class features, such as the unidirectional cab module, pulse generators, and robust automation system, provide the flexibility and accuracy needed for today's complex device fabrication processes. EV GROUP EV 501 is ideal for both laboratory and production applications.