Used EVG / EV GROUP Hercules / 640 / 150 #9012479 for sale

Lithography Track / Aligner / Coater and Developer System, 6" Specifications: Basic unit: Fully automated lithography system for up to 8" wafers Exposure modes: hard, soft, vacuum-contact Proximity adjustable from 1 to 400µm in 1µm steps Computer control of all mechanical movements in aligner with industrial computer system (with host PC) Single 19" monitor for operator interface and alignment functions Alignment stage with stepping motor-controlled adjustment of X/Y/Theta High-resolution alignment in 0.125µm steps in X/Y/Theta Joystick control of all alignment movements on stage and microscope Electronic planarization with proximity sensors, resolution: 200nm Alignment accuracy: ± 0.5µm (with 20x objectives) Contact pressure wafer to mask or wafer to wafer: 0.5N to 35N (mask protection, no contamination) Self diagnostics during machine start up Automatic initialization of all stepping motors, position end switches, sensors and pneumatics Remote diagnostics via modem Light source: Lamp house for lamps up to 500W, including: Dielectric mirror (wavelength 350 to 450nm) Fly-eye lens Shutter (39 ms response time) Light integrator Field lens, 8" Optimized parallel light: Uniformity: ± 2% with 4" wafer, ± 4% with 6" wafer, ± 5% with 8" wafer Universal power supply: up to 1000W for Hg & HgXe lamps (for DUV option) Adjustment plate for UV probes with 44.5mm and maximum height of 16mm Software: MS-Windows based process software for recipes, diagnostics, operation PC-controlled operating environment, self-explaining commands in the process Storage of up to 99 different parameter sets in a file, multiple files Password-protected access levels: operator/engineer/maintenance Print file for the stored recipes Illumination software controlled, storable in recipes System configured for nitrogen purged proximity expose: Manually controlled flow controller (needle valve) with flow meter for N2 flow Programmable purge time prior to exposure Top side microscope: Fully motorized splitfield microscope for top side viewing High-resolution CCD camera, monitored in process window Motorized (2) position objective turret Display and storage of objective positions Optional special objectives for 8mm minimum objective distance (optical axis) (2) Objectives: 10x (3.6x to 20x available) 500W lamp Mask holder for 6" masks: Round opening for exposure of wafers Hard coat surface finish with < 1µm flatness for mask area Bottom loading system with automated vacuum transfer Wafer chuck for 4" wafers: Hard coat surface finish with < 1µm flatness for wafer area Windows for bottom side alignment For soft, hard contact exposure, proximity and vacuum contact Mask holder for 7" masks: Round opening for exposure of wafers Hard coat surface finish with < 1µm flatness for mask area Bottom loading system with automated vacuum transfer Wafer chuck for 6" wafers: Hard coat surface finish with < 1µm flatness for wafer area Windows for bottom side alignment For soft, hard contact exposure, proximity and vacuum contact Automatic alignment: With vision system (integrated in PC) Storage of trained mask and substrate patters on hard disk Software fully integrated in the computer control User trainable alignment marks Easy operation with menu assisted training of mask and wafer alignment marks Alignment results are dependent upon process conditions and material properties 2002 vintage.