Used EVG / EV GROUP IQ Aligner #293735310 for sale
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ID: 293735310
Wafer Size: 6"-8"
Vintage: 2007
Mask aligner, 6"-8"
Maximum separation: 300 µm
Thickness:
Mask aligner: 0.1 - 10 mm
Bond aligner: 0.1 - 3 mm
Alignment:
X,Y Range +/- 5 mm
Rotation: Theta +/- 3.5°
3-Axis joystick
Resolution: 0.06 µm
Mask aligner: 0.5 µm
Bond aligner: 0.5 µm
Exposure modes:
Hard contact
Soft contact
Vacuum contact
Vacuum + Hard contact
Proximity
Microscope objective range:
Top side:
X: 30 - 130 mm
Y: +/- 65 mm - 150 mm
Z: +/- 3 mm
Bottom side:
X: 30 - 100 mm
Y: +/- 12 mm
Z: +/- 5 mm
Monitor / Camera:
Power supply: 350 -500 W
2007 vintage.
EVG / EV GROUP IQ Aligner is a cutting-edge mask aligner equipment designed for high precision and high throughput semiconductor lithography applications. This advanced tool incorporates state-of-the-art alignment and exposure technologies to enable accurate patterning of features on various substrates with exceptional control and repeatability. One of the key features of EVG IQ Aligner is its advanced alignment capability. The system utilizes a high-resolution alignment camera and microscope to achieve precise alignment of the mask and substrate. This ensures that patterns are accurately transferred onto the substrate with minimal overlay errors. The alignment process is fully automated, reducing the need for manual intervention and increasing the overall efficiency of the lithography process. EV GROUP IQ Aligner also offers a range of exposure modes to accommodate different lithography requirements. The unit supports proximity, soft, hard, and vacuum contact exposure modes, allowing users to select the most suitable exposure technique based on their specific application needs. These exposure modes enable the machine to handle a wide range of substrates, including silicon wafers, glass substrates, and flexible substrates, making it a versatile solution for various semiconductor fabrication processes. In addition to its advanced alignment and exposure capabilities, IQ Aligner is equipped with a number of innovative features designed to enhance process flexibility and control. The tool includes automated wafer handling and loading capabilities, as well as software-controlled exposure parameters for easy customization of lithography processes. Its intuitive user interface allows operators to monitor and adjust process parameters in real-time, ensuring optimal performance and reproducibility. Moreover, EVG / EV GROUP IQ Aligner is designed for high throughput production environments, with fast exposure times and efficient substrate handling mechanisms. The asset is capable of patterning large areas of the substrate with high resolution and uniformity, making it ideal for mass production of semiconductor devices. Its robust construction and high-quality components ensure long-term reliability and stability, even in demanding manufacturing environments. Overall, EVG IQ Aligner represents a state-of-the-art solution for semiconductor lithography applications, offering unparalleled precision, reliability, and flexibility. Its advanced alignment and exposure technologies, coupled with innovative features for process control and automation, make it a valuable tool for semiconductor manufacturers looking to achieve high-quality patterning results with superior productivity and efficiency. With its superior performance and advanced capabilities, EV GROUP IQ Aligner is poised to become a leading choice for semiconductor lithography processes in the industry.
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