Used EVG / EV GROUP IQ #9138247 for sale
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ID: 9138247
Nano imprint lithography system, 8"
Top-side alignment only
Manual load
Wiring removal
Basic unit 200mm:
Flat screen:17"
Self Diagnostics during machine startup
Automatic initialization:All motors,encoders,limit switches,sensors and pneumatic
Remote diagnostics
Quick change:Stamp holders and imprint chucks
EC declaration of conformity
PC controlled operating environment
Solid state drive and hard drive
Earthquake protection device
Software:
MS-windows
Process software ,processing and diagnostics
Automated recording
Storage of files in hard disk or network
Password protected
Internal wedge compensation unit:
Automatic wedge compensation
Motorized alignment stage:
X,Y,T alignment
High resolution alignment
(3) axis joystick
Reinforced stage drives
Top side microscope:
Fully motorized split field microscope
Travel range X: 90-200mm*
Travel range Y: -10-100mm*
(3) axis joystick control
Display and storage of microscope position
(2) Objective 5x
Automatic alignment for top and / or bottom side:
Vision system
Storage of stamp and patterns on hard disk
Top and bottom side alignment
Stamp and wafer alignment marks
Large gap alignment capability:
Alignment at substrate separations >50um
Alignment during UV molding
Alignment during UV bonding
Manual wafer loading capability:
Motorized swivel arm
software integrated
(2kg) Manual substrate loading/unloading
Wafer loading trays
Wafer loading frame for 200mm wafers/stamps:
Manual wafer loading on chuck
process integrated substrate vacuum fixing
Notch or flat with pins
External wafer thickness measurement station:
(3) Point wafer thickness detection
Contact less imprinting
(3) Sensors adjustable range :150-200mm
Designed Warped substrate :1mm
Manual Operation
Sensors range: up to 10mm
manual system only
500W-1000W Light source NUV:
Lamp house :500w or 1000w
NUV range:280-450nm
Optimized parallel Light:+/-3% on 150mm and +/-4% on 200mm
Adjustable plate: diameter 44.5mm and max.height 16mm
Optical set for wave length range 350-450nm:
NUV and DUV light sources
Field lens:200mm
Dielectric mirror
Fly's eye lens
Stamp holder for 200mm UV hybrid lens molding:
UV molding automated de-embossing function
Hard coat surface finish
Quartz backplane
Imprint chuck for 200mm wafers/stamps:
Bottom chuck: 200mm wafer
Top side alignment
Hard coat surface finish
Manual and automated loading
Software for UV hybrid lens molding:
UV molding process flow
Designed for puddle dispense
Recipe parameters and user guidance
Software to compensate with specified tolerance
Force control capability up to 400N:
Load cells implemented
Maximum controllable imprint: 400N
Force control during imprint
Force control during UV exposure
UV molding software
Tooling for 200mm UV bonding,stamp fabrication and MLM:
Top substrate holder
Special quartz backplane with edge vacuum groove
Mechanical clamping
Vacuum supply to backplane via tube
Software for master and sub-master replication:
UV molding process flow
Tooling for polymer stamp fabrication
Software to compensate product within specified tolerance
Software for UV monolithic lens molding:
UV molding process flow
UV molding tools for puddle dispense
Recipe parameters and user guidance
Software to compensate with specified tolerance
Diffuser plate for tooling for stamp fabrication + MLM:
Tooling for stamp fabrication + MLM
Diffuser plate onto backplane prior to UV exposure step
Diffuser plate for hybrid lens molding tooling:
Hybrid lens molding tooling
Diffuser plate onto backplane prior to UV exposure step
Recipe controlled microscope illumination spectrum:
Contrast improving illumination system
Increased pattern visibility
Improved alignment reliability
(3) Adjustable LED light sources per microscope
Autom.Arm for puddle dispense and de-ionization:
Motorized swivel arm
Software integrated
Programmable dispense arm/nozzle
Puddle dispense of imprint material: up to 4 lines
Right-hand side alignment
Host ionization system
Ionization system:
Ionization nozzle with power supply
De-ionizing of stamp and substrate
Syringe dispense system:
Syringes :up to 3
(2) Dispense lines
Universal resists applications
Resist with short shelf life time
Programmable dispense rate
Adjustable suck back
Different resist and polymer viscosity
Chemistry cabinet:
Housing with front door access
Encapsulating of syringe dispense systems / arm
Exhaust port
Prepared for later pump upgrade
Pre-installed weight cell
2011 vintage.
EVG / EV GROUP IQ Mask Aligner is a high-precision, high-throughput wafer-level lithography equipment used in the semiconductor industry to pattern small devices such as chips, transistors, and other circuit elements. This advanced tool offers ultra-high resolution at high line edge roughness (LER) and overlay precision to improve device performance and yields. It utilizes an advanced wafer stage, laser interferometer for precise wafer alignment and motion control and utilizes a synchronized step-and-repeat method to project the desired image onto the wafer in a fast and repeatable way. EVG IQ Mask Aligner uses a beam-splitting lens to direct a laser light onto a rectangular mirror that reflects it onto the mask and photoresist-coated wafer, exposing them simultaneously, allowing for advanced multi-layer patterns to be created. The beam splitting lens also provides a source of illumination to the mask and wafer, so that each is exposed to the full intensity of the lithography system's source beam. EV GROUP IQ Mask Aligner is capable of printing sub-50nm features on standard aligners, or features on the sub-30nm scale with specialized equipment, making it ideal for fabricating advanced ICs and MEMs devices. To achieve such small features, the unit utilizes, powerful, high-fidelity digital stepper motors that drive the lens and cranker mechanisms to accurately move the wafer, aligh it, and patter. This enables a highly accurate and repeatable printing process. The wafer is held in place by a vacuum chuck, while an alignment laser is used to adjust the wafer's position, and ensure that it is aligned accurately with the mask. This allows for true overlay measurements from printing to printing. Finally, an additional ultraviolet-visible laser is used to scan for a wide range of mask and wafer features, reducing time between prints so that wafers can be processed quickly and efficiently. IQ Mask Aligner offers remarkable pattern precision, including line width control on the order of ±5nm and LER of less than 1nm. The machine is also highly reliable, with a service life of more than 20 years. With rapid throughput capabilities and advanced lithographic control, the tool is able to product accurate, complex patterns rapidly. As such, it is an invaluable tool for those in the semiconductor sector looking for high-precision, high-throughput wafer-level lithography solutions.
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