Used HTG 84-3 #9198923 for sale
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ID: 9198923
Vintage: 1986
UV Mask aligner
With microscope
UV Lamp power supply
High resolution
Sub-micron printing
Contact and proximity exposures
Scale production alignment capability
Silicon, GaAs, LiNb, InP
Consistent printing:
Wafers
Rectangular substrates
Odd sized / Brittle materials
Single or split field viewing
Up to 600x magnification on the optics
Alignment accuracy: ±1 µm
Precise wafer to mask leveling
Highly collimated UV/deep UV exposure systems
Two channel intensity controlling power supply systems
Stationary alignment tooling
Vibration isolation console
Differential micrometers
Self planarizing chucks
Wafer chuck and mask holder included
Wafer chuck motions:
X, Y, Z and ø (direct drive)
Z-Axis adjustment: ±750µ
Air-bearing planarization system
Wafer / Substrate size: Up to 6.0" wafers / Square substrates
Mask rotation: 180°
Mask size: 7.0" x 7.0"
Vacuum mask clamp
Pneumatic mask assembly lift
Front side alignment accuracy: <0.5µ
Printing resolution:
Near UV: <0.8µ
Mid UV: <0.4µ
Deep UV: <0.3µ
Control functions:
Power
Test
Substrate vacuum
Mask vacuum
Contact vacuum
Expose
Cycle
Skip
Mask lift
N2 Purge
Timer:
000.1 to 999.9 sec
0.1 increments
Gauges:
System vacuum
Contact vacuum
N2
1986 vintage.
HTG 84-3 is a mask aligner used in the manufacturing process of semiconductor devices. It is an advanced tool capable of aligning and patterning semiconductor masks with the highest precision and accuracy. The main components of 84-3 include a mask aligner main unit, a vacuum chamber, and a vacuum equipment. The mask aligner main unit is composed of an X-Y stage, a laser alignment system, and vacuum unit. The mask aligner main unit is responsible for moving the mask, laser projection machine and vacuum alignment stage to the appropriate location within the vacuum chamber. The laser projection tool consists of a laser source, a collimator, and a series of lenses that project laser beams onto the mask and wafer to align them. The laser source is normally a Helium-Neon (He-Ne) laser. The collimator is used to focus the laser beam onto small diameter of the mask or wafer. The laser projection asset also includes an inspection model, which is used to detect irregularities in the positions and shapes of the mask and wafer. The inspection equipment consists of a series of cameras that are capable of capturing images of the mask and wafer, and then comparing the images to pre-programmed data for errors. The vacuum chamber is used to seal the mask and wafer for accurate alignment. The chamber contains a vacuum system, which prevents a pressure buildup that can interfere with the accuracy of the alignment process. The vacuum unit also protects the mask and wafer from contamination by dust particles or other debris. HTG 84-3 is highly precise and accurate and is capable of aligning masks and wafers to within 0.0025mm accuracy. The machine is also fast, capable of aligning a mask and wafer within 0.2 seconds, and can be used for a variety of application, such as contact and non-contact masks. Overall, 84-3 is a versatile and reliable mask aligner that is designed to provide superior performance and accuracy. Its precision and accuracy make it a valuable tool for semiconductor device manufacturing.
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