Used KARL SUSS / MICROTEC MA-150 #9248592 for sale

KARL SUSS / MICROTEC MA-150 is a high precision mask aligner used for the purpose of photolithographic patterning of materials on substrates in the microelectronics industry. The design of the equipment is based upon the principle of optical alignment of a light sensitive (photoresist) template to a substrate. Within MICROTEC MA150 system, two independent stages are used. The alignment stages functions in a way that allows the operator to precisely align the substrate and the photomask to themselves. This is achieved through a pair of Heidenhains that are able to precisely move the substrate and photomask x, y and z axes. The design of the unit utilises sensors and ultra-precise manual adjustments for a final alignment and positioning of the substrates. This allows for the operator to attain sub-micron accuracy when aligning the photomask onto the substrate. The machine also contains an integrated wafer alignment laser which aides in the alignment process. This laser allows for the user to rapidly find and localise the substrate for precise alignment. Furthermore, the tool can be used for low and high volume production runs due to its high accuracy and maximum alignment repeatability. In order to ensure high photomask repeatability KARL SUSS MA 150 implements an industrial grade laser. This laser is able to produce a repeatable line displacements of less than one micron on the photomask. This enables the asset to achieve high precision even on large substrate wafers. MICROTEC MA-150 model can also accept a wide range of photoresist materials, providing the flexibility to process a variety of wafers with different sizes and thickness. The equipment also features an integrated cooling option, allowing the mask aligner to achieve uniform exposure throughout the entire substrate. Finally, MA 150 system is equipped with advanced software that allows for the full control of the process. This software can be used to control the exposure dose and the exposure time, making complex processes such as multi-layer patterning a lot simpler. Furthermore, the unit provides the ability to control the thickness of the resist layer for high precision processes.