Used KARL SUSS / MICROTEC MA 200 #9238413 for sale

KARL SUSS / MICROTEC MA 200
ID: 9238413
Wafer Size: 8"
Vintage: 1989
Mask aligner, 8" Proximity mode Special cassette loader / Unloader XRS PAL And top side alignment CIC1000 Lamp power supply DVM8 Field expander AL3000 Auto align Lamp: 1000 Watts LEITZ: 25x Mask, 9" UV400 LH1000 1989 vintage.
KARL SUSS / MICROTEC MA 200 is a versatile and precision-engineered mask aligner. It provides accurate and repeatable alignment of wafers and masks with high uniformity and repeatability. This device allows precise alignment of substrates with up to 200 mm diameter to masks with up to 880 mm diameter. MICROTEC MA200 is designed for production lithography. It features a simple, user-friendly interface that enables users to quickly program the desired alignment and exposure parameters. The software controlling the machine is robust and easy to understand. It also offers advanced features such as the ability to store programs, automatic adjustment of the illumination equipment, and an operator assistant for fine-tuning. KARL SUSS MA-200 employs an array of advanced precision optics and electronics to ensure precision alignment and exposure of semiconductor wafers and other substrates. The optics employ copper-vapor laser beam and stepper motor-driven lens system to provide precise alignment. A motorized wafer-to-mask alignment unit with a precision of up to 30 nm ensures repeatable and accurate alignment of the substrates to the masks. The optics is also capable of lateral, height, and lateral tilt correction, as well as non-contact wafer-to-mask profile matching. MA-200 also features an automated mask handling machine for wafer-to-mask exchange and the handling of large lenses. The wafer-to-mask exchange is performed using an elevator tool, and a vacuum asset precisely holds and releases the wafers and masks. The advanced optics live within an environment of temperature and humidity control, ensuring maximum protection to the lithography process. KARL SUSS MA200 offers an efficient and cost-effective solution for production mask practices, ensuring precision alignment and exposure of wafer substrates at a speed of up to 16 wafers per hour. This makes the model ideal for high-volume production applications.
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