Used KARL SUSS / MICROTEC MA 8 / BA 8 Gen 2 #293652018 for sale

ID: 293652018
Vintage: 2006
Mask aligner 2006 vintage.
KARL SUSS / MICROTEC MA 8 / BA 8 Gen2 is an advanced alignment and exposure tool which provides high resolution and precision for photolithography processes. It enables both single layer and multiple layer processes for wafer-based applications. The equipment offers a complete solution for medium to high volume production requirements. MICROTEC MA 8 / BA 8 Gen2 provides high throughput capabilities, with the option to integrate multiple exposure sources, from single to quad-light sources. This supports fast positional overlays and exposure time optimization. It has a high accuracy 6-axis mask and substrate aligners for accurate over-lay, as well as precision wafer movement for high resolution alignment. The system also offers non-contact resist and substrate temperature control for optimum results. It can handle a variety of masks and substrates up to 270 mm in size, with a high positional registration accuracy of up to 5 μm across all three axes. The unit supports mask sizes from 2" to 9", with the option of an interchangeable mask holder with several clamping positions. The machine offers on-board comprehensive process control, with a dual-beam alignment unit and a built-in wafer navigation compass. It supports both automatic optical focus and alignment with fixed field of view, as well as fully automated mask alignment and exposure cycles. The tool's advanced targeting verifies the registration accuracy of each exposed image with high accuracy. KARL SUSS MA 8 / BA 8 Gen2 is designed for robust and reliable operation, ensuring an enhanced user experience. It has an extensive environmental control, including a wide temperature range, humidity control, and clean-air options for creating an optimal working environment for wafer processing. Overall, MA 8 / BA 8 Gen2 is a versatile, high performance mask aligner which provides outstanding accuracy and precision for a wide range of applications. It has the flexibility to meet both low-volume and high-volume production requirements, enabling the reliable production of ultra-precise components.
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