Used KARL SUSS / MICROTEC MA 8 / BA 8 Gen3 #293609808 for sale
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ID: 293609808
Mask aligner
Movement range mask aligner mode: X +/-5.0mm, Y +/- 5.0mm, Theta +/-5°
Movement range bond aligner mode: X +/-3.0mm, Y +/- 3.0mm, Theta +/-3°
Zero position:
Machine base frame: Mechanical, pneumatic, electrical 230V 50/60Hz
Joystick X/Y- and THETA for alignment stage control
TSA Microscope stage with manual / Motorized X-Y-manipulator and rotation
Integrated microscope tilt
BA function:
Manual loading and unloading
PLC Control with LCD display
WINDOWS GUI
Wafer 3" up to 200 mm diameter for bond application
Operator manual
For BSA microscopes with working distance 33mm
Adaption kit Included for constant dose exposure mode
Implemented tooling rack for tooling storage
Qty / Part number / Description
(1) / G206986 / Mask and bond aligner
(1) / 100002005 / Pneumatic expansion kit (BA/UV-NIL/SCIL/SMILE)
(1) / G207694 / Housing TSA/BSA
(1) / 100002830 / Alignment stage WD-33/MOT/A-200
(1) / G207720 / Operation desk mot
(1) / G206685 / M608 Microscope lift mot
(1) / 100000786 / M608 Visual / Screen splitfield microscope / AL400
(2) / G156881 / Turret
(2) / G145984 / Single objective umpl FL 5X/0.15
(1) / G206017 / Exposure unit LH1000
(1) / G179183 / Lamp adapter LH1000/1000W
(1) / G202518 / Lamp power supply unit cic 1200/LH1000
(1) / G206080 / OPTICS UV400/HR/W-200/LH1500
(1) / G206829 / 2 Channels light-sensor 365/405NMFORCIC
(1) / 100018553 / Adapter system for maskholder
(1) / 100008204 / Mask holder
(1) / 100020052 / Mask holder BL/PROX/CONT/M-7-9/W-150.
KARL SUSS / MICROTEC MA 8 / BA 8 Gen3 is a high-precision, high-accuracy mask aligner for photolithography applications. This device performs mask alignment, wafer exposure and lift-off processes, primarily for the production of precision micro-circuits and photolithography masks. Equipped with a two-dimensional, two-axis micro-drive, MICROTEC MA8BA8-GEN3 mask aligner is capable of providing top-notch accuracy, accuracy and precision without sacrificing time or effort - even with high-density alignments. KARL SUSS MA 8 / BA 8 GEN 3 is capable of up to 8 micron resolution, with advanced features like automatic pre-aligned registration and advanced focus control. Additionally, the mask aligner is driverless and features optical alignment to ensure high-precision positioning. The device supports specialty materials, such as thin films, with its optimized thin-glass handling mechanisms. Furthermore, with variable alignment speeds and angular adjustments, KARL SUSS / MICROTEC MA 8 / BA 8 GEN 3 is able to reduce cycle times and prevent focusing variability. For correction purposes and beyond, a series of graphic user interfaces are featured that can help with the optimization and troubleshooting of the mask aligner. This includes a graphic simulation feature to ensure accurate alignment results prior and during the process. To further ensure high accuracy, KARL SUSS MA8BA8-GEN3 mask aligner also supports multiple inspection and calibration positions, including a non-contact, non-contact depth measurement system. Able to accommodate up to six CCD cameras, MICROTEC MA 8 / BA 8 GEN 3 is suited for batch-processing or single-wafer applications. It also features turret-mounted viewports with low thermal dispersion for laser alignment enhancement, as well as a rotating joystick for easy alignment. The mask aligner is powered with MICROTEC SuperMultiDrive software, making it compatible with all standard thermal, e-beam and optical lithography systems. With unparalleled accuracy and precision, MICROTEC MA 8 / BA 8 Gen3 mask aligner provides excellent lithography results for both photomask and wafer exposures. Offering superior wafer processing capabilities, this device is an essential tool for any micro-electronics facility.
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