Used KARL SUSS / MICROTEC MA 8 / BA 8 Gen3 #293800513 for sale
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ID: 293800513
Wafer Size: 8"
Vintage: 2017
Mask aligner, 8"
Alignment functions:
Top Side Alignment (TSA)
Bottom Side Alignment (BSA)
Substrate size: Up to 8“ x 8”
Resolution: 0.5 µm
BSA Alignment accuracy: <1 µm
Alignment gap programmable: 1 to 100 µm
Mask aligner mode: X ±5.0 mm, Y±5.0, Θ±5°
Bond aligner mode: X ±3.0 mm, Y±3.0, Θ±3°
Motorized stage: 0.1 µm
LH1000 Exposure unit
LH1500 Lamp housing unit
PLC Control with LCD Display
Operating system: Windows GUI
2017 vintage.
KARL SUSS / MICROTEC MA 8 / BA 8 Gen3 is a fully automated mask aligner used to quickly and accurately expose wafers in production runs. The unit is composed of a throughput spinner, precise pattern registration equipment, and a high-performance polyimide-resist system. The throughput spinner on MICROTEC MA8BA8-GEN3 is capable of rapid processing with a throughput rate of up to 8 wafers per hour. The spinner uses a highly accurate speed control unit to ensure a consistent and reliable exposure. Additionally, the spinner allows for precise control over the depth of focus with its patented 3D auto-focus feature, and it also includes a fiducial-tracking machine that tracks and corrects for significant positional errors on the substrate. The pattern registration tool of KARL SUSS MA 8 / BA 8 GEN 3 is designed for rapid and complete registration of fine patterns on a wafer. The unit is equipped with an edge detection asset and an image stitch-back capture model to acquire high-precision alignment performance. Additionally, a suite of high-resolution zoom optics allows for the precise scrutiny of patterns to ensure quality alignment. The polyimide-resist equipment of MICROTEC MA 8 / BA 8 GEN 3 is designed for the exposure of wafers with a variety of resist and substrates. The unit is equipped with a wide range of variable exposure parameters, including intensity, exposure area, and resolution, allowing for great flexibility in application. It is also equipped with an advanced contamination-control system that accurately controls the residual atmospheric particle contamination. MA8BA8-GEN3 is a cost-efficient and reliable mask aligner that is designed for production runs of high-precision pattern alignment for a variety of substrates and resist. It is capable of rapid processing with its throughput spinner, and its precise pattern registration and polyimide-resist systems ensure the quality alignment of delicate patterns. Finally, the unit also includes an advanced contamination-control unit for improved process uniformity.
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