Used Mark Aligner System #9007724 for sale

Mark Aligner System
Manufacturer
Mark Aligner
Model
System
ID: 9007724
Wafer Size: 8"
Mask Aligner / Exposure Tool, up to 8" Substrate Size: Round or square Mask size: 3"x3" up to 10"x10" Exposure System Lamp power: 350W, 500W, 1000W, 2000W, 5000W Intensity (8" field @ 365nm): 20mw/cm2 (1000W), 40mw/cm2 (2000W) Uniformity: Better than ±5% Resolution: Proximity mode 3.0μm, Contact mode <1.0μm Exposure Modes: proximity, soft, hard, vacuum Exposure Gap: 1-1500μm Gap Adjustment resolution: 1μm Alignment System Alignment Accuracy: 0.5μm topside, 1.0μm backside Alignment Gap: up to 1500μm Alignment Range (X,Y): ±3mm Alignment Range (Ø): ±3o Mechanical Resolution: 0.1μm Alignment Microscopes Microscope Type: Dual zoom, CCD TV camera Magnification: Approx. 30X - 210X Illumination: Solid state LED Cost of Ownership Throughput: >100wph MTBF: >1500 hours MTTR: <4 hours Uptime: >95% Consumables Vacuum: 25"HG Nitrogen: 20 PSI Power: 208V, 60Hz, 20A, 3-phase UV Lamps.
A mask aligner Mark Aligner Equipment, commonly referred to as a System, is an automated semiconductor fabrication machine used for the positioning and alignment of photomasks to be aligned with substrates. It consists of three main components: a light source, an imaging Mark Aligner Unit, and an alignment stage. The light source is usually a UV lamp which illuminates the photomask and the substrate in order to generate an image for the imaging Machine. The imaging Mark Aligner Tool captures a high-resolution image or view of the two objects that is then used for the alignment process. The alignment stage is the motor driven Asset which uses that image to accurately and precisely align the objects. It typically utilizes a closed loop Mark Aligner Model that actively detects any misalignment and corrects for it. The mask aligner Equipment is used in the fabrication process for creating integrated circuits (ICs). A photomask is a glass plate that contains the pattern of the integrated circuit and it needs to be accurately positioned onto the wafer. The mask aligner Mark Aligner System is used to ensure that the position and orientation of the photomask is correct in relation to the wafer itself. The mask aligner is also used for subsequent metrology and overlay measurements to ensure that the layers of the IC have been accurately aligned and patterned. In order to achieve accurate alignments, Unit has a number of automated features such as autofocus, autodrift and autotilt. Autofocus uses an algorithm to detect the focus of each image and then adjust the image accordingly so as to maximize the accuracy of the alignment. Autodrift is used to maintain the alignment of the photomask and substrate even as the mask is being moved in order to achieve alignment. Finally, autotilt is used to ensure that the photomask is always at the same angle relative to the substrate. Overall, Mark Aligner Machine provides a high level of accuracy in alignment and is crucial for performing high quality fabrication jobs in the production of integrated circuits.
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