Used OAI 400 #9024062 for sale

OAI 400 is an optical auto-alignment equipment designed for large wafer scale alignment used in the mainstream photolithography process. 400 has an integrated design with a highly precise quadruple-reflection beam splitter and curved mirror, which enables fast, accurate alignment at 0.2-micron levels. This enables superior automatic wafer-level alignment for large area patterning up to a OAI 400-mm wafer scale. The optical auto-alignment system is mainly composed of an 400 head, a mask stage, a wafer stage, and a controller. OAI 400 has a mask and wafer stage with large travel ranges that provide wide fields of view to complete accurate and high-precision measurements. The controller is used to coordinate all the movements of the unit. The alignment head can be set with different configurations for a wide range of applications. The machine has two independent CCD cameras to capture different angles of a wafer and a mask image at the same time. When it comes to alignment accuracy, 400 offers an impressive 0.2-micron level in the x-y plane. This mask aligner uses a five-axis motion controller for accurate positioning in the z-direction. OAI 400 also features a high-speed alignment algorithm that can automatically align a mask image with a wafer image at 200 ms/alignment. Its advanced vision processing algorithms and features make it ideal for large mask alignments. The tool can process images quickly and accurately, and the results are easy to interpret. In addition, 400 also has an integrated calibration asset with a tightly controlled environment for accurate and reliable alignment. This calibration model can be set up to adjust different parameters for different application requirements. OAI 400 is compatible with many DFM processes, such as advanced alignment software and laser alignment. It is also designed to work within a vacuum environment. Overall, 400 is a reliable and cost-effective mask aligner equipment for large area patterning. It is easy to use and provides highly accurate alignment at 0.2-micron levels, which makes it ideal for use in high-precision photolithography processes. Its integrated calibration system and advanced vision processing algorithms allow for fast, reliable readings that are easy to interpret. It is also designed to work within a vacuum environment, which makes it suitable for use with Laser Alignment.