Used OAI Hybralign 200 #293591858 for sale

Manufacturer
OAI
Model
Hybralign 200
ID: 293591858
Mask aligner.
OAI Hybralign 200 is a mask aligner used by the semiconductor industry for precision wafer alignment. This device is capable of aligning up to 200 wafers per second, allowing a full wafer to be aligned within 1 second. Hybralign 200 is a unique tool, as it combines the best features of contact mask aligners and optical scanners to offer the highest accuracy and throughput of any mask aligner in its class. OAI Hybralign 200 uses a protruding alignment pin and a vacuum cup system to accurately locate and position the wafer. The pin is used to locate the outer corner of the die and a stable connection is achieved between the wafer and the Hybralign base plate by a proprietary vacuum cup placement system. Once the wafer is securely held in place, four LEDs with different spectral ranges are used to detect and align the wafer. This allows for scanning and alignment of both opaque and semi-transparent masks. Hybralign 200 also features a ContourFinder 2D TM module, which adds an additional layer of accuracy in determining the shape of the wafer and ensures precise wafer alignment even in challenging cases. The device features a resolution of 0.2um in x and Y with an alignment accuracy of 15um. There is also an optional score alignment mode that can provide an additional 5um of alignment accuracy. This improved accuracy enables OAI Hybralign 200 to be used in both low cost devices and those featuring a high number of critical points. The system is also compatible with various types of reticles and masks, including plastic, metal and patterned. Hybralign 200 provides a high throughput, precise performance and scalability, enabling the device to be used in both small and large chip fabrication plants. This makes it an ideal tool for both wafer patterning and production testing. This cost effective tool delivers the speed and accuracy necessary for a wide range of semiconductor applications, including high density packaging, MEMS, and embedded systems.
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