Used OAI HYBRALIGN 400 #9012379 for sale

Manufacturer
OAI
Model
HYBRALIGN 400
ID: 9012379
Mask aligner HTG 500 W power supply OAI controller box Zeiss dual head alignment scope Objectives: 2x / 5x / 20x Stored in a cleanroom.
OAI HybriLign 400 Mask Aligner is a powerful, technologically advanced mask aligner designed to increase production efficiency while minimizing user operation time. Featuring a wide range of alignment functions, it is designed for use in the production of semiconductor wafers, microcircuits, and other microintegrated elements. It is the first thin wafer mask alignment machine specifically engineered for high volume production. It combines laser mask alignment techniques with traditional optical shadow mask alignment and transmission imaging to offer submicron precision in the registration of masks used in the fabrication of semiconductor wafers. With its ability to align multiple wafers in a single action, it can drastically reduce the need for manual sample-by-sample adjustement, allowing high throughput manufacturing. The HybriLign 400 features two non-contact laser beam sources, an optical objective system, an edge detection subsystem, and a digital field-of-view with various magnification levels. This allows it to locate masked patterns extremely quickly and accurately - with a resolution as fine as ±1µm - while leaving a fully controllable mark-free region around the pattern. The field of view also extends into separate fields, to enable simultaneous alignment from different angles. This affords greater accuracy when more precision is needed. It also allows high-speed production of complex patterns than can be difficult to produce with traditional optical shadow mask alignment. In addition, the HybriLign 400 offers a proprietary Active Level Alignment feature, which quickly corrects any misalignments in predetermined layers. This provides operators with a more precise method of monitoring the way masks are aligned, as the error can be corrected in near real-time. The advanced design and technology of the HybriLign 400 makes it an ideal choice for high-performance and accuracy in the manufacturing of microintegrated devices. Its ability to handle thin wafer production and perform the alignment in-situ make it stand out from the competition.
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