Used ORIEL 8097 #9096377 for sale

ORIEL 8097 is an Aligner-Prober Mask Stepper used in device fabrication processes. It is used to transfer a photoresist pattern attained from a reticle onto a silicon substrate for precise alignment and controlled deposition. The mask aligner features an automated 42 mm reticle exchange equipment for faster loading, promoting efficient production processes. 8097 has a standard field-of-view (FOV) of 8x8 inches, accompanied by an automated wafer index system for full field control during the alignment process. Furthermore, its XY motion control capabilities, coupled with further configuration options such as auto-focusing, backside alignment, and a die-to-die alignment option, offer flexible alignment scenarios. The full-field aligner also features a vision unit for precise alignment via an expanded 20-bit imaging processor and a high-resolution 0.74 µm TV Spot CCD camera with global shutter technology. ORIEL 8097 is available with multiple alignment modes, including pixel mask matching, brightfield, edgescan wafer overlays, pattern detection, and real-time inspection. Additionally, its reticle features an autofocus mechanism with precision control through manual and algorithmic coordinate adjustments. Furthermore, it comes equipped with a variety of linear and segmented actuators for precision parallelism and planarity in substrate or mask alignment. 8097 is powered by a Linux real-time operating machine and a human-machine interface (HMI) for efficient operation. It has a step resolution of 0.5-1.0 µm, a maximum writing field of up to 4 inches, and a stage accuracy of 8.0 µm (3-Sigma). The entire tool operates in a wafer cassette environment, capable of accommodating 8-inch to 200 mm wafers, as well as up to 42 mm reticles in the reticle magazine. Its graphical user interface (GUI) enables easy program set-up and automated stepper control. Furthermore, ORIEL 8097 comes with an integrated high-vacuum (HV) plasma desmearing station for post-process cleaning and a vacuum halo-reduction station to minimize particle concentration. Additionally, it includes a heated clamping chuck to minimize thermal stress effects on the substrate, a UV flood lamp for exposure to UV light source, and an integrated roof-lifter asset with ±100 µm accuracy for controlling the gap distance between mask and wafer to sub-micron accuracy. In conclusion, 8097 is a mask aligner designed with precision, reliability, and scalability in mind. It is an ideal choice for the deposition of photoresist onto substrates with accuracy and speed. This stepper is designed to provide a maximum of three-year product life, which ensures a high return on investment and efficient production.