Used RORZE RA410-812-101-1 #9384821 for sale

RORZE RA410-812-101-1 is a mask aligner designed to etch precise patterns and structures on semiconductor wafers. It uses light, usually ultraviolet (UV) light, to transfer a pattern from a photomask onto the wafer in a process called photolithography. The beam in RA410-812-101-1 is composed of ultraviolet radiation, usually with wavelengths ranging from 365 to 405 nanometers. Typically, the mask aligner contains two wafer stages. The first is the transfer stage, which accurately moves the mask and wafer by means of positioning encoders. The second is the exposure stage, which consists of the light source, the mask holder, a light collimating equipment and the optical projection system. The mask holder holds the photomask, which is a dichroic glass containing a pattern etched in chrome. The optical projection unit uses a combination of lenses and mirrors to project the mask pattern onto the wafer surface. RORZE RA410-812-101-1 is also equipped with a control unit with touchscreen LCD providing real time parameters information, such as thermal drift, stage alignment, and beam alignment. This control unit also includes a measurement station. This station contains precise measuring encoders to detect and compensate for any distortion of the mask and wafer during movement. RA410-812-101-1 also contains a precision temperature control machine. This is important, as it helps to ensure that the wafer does not undergo thermal expansion during exposure, as this can cause a distortion of the pattern and damage the wafer. The temperature control tool can maintain the temperature of the wafer to within ± 0.2 °C. The RA410-812-101-1can reduce exposure time, minimize assembly time, and show edge distortioning, obscuration, and critical dimensioning within the mask tolerances with high throughput, repeatability, and accuracy. Overall, RORZE RA410-812-101-1 mask aligner is a reliable and precise machine for etching patterns onto semiconductor wafers. Its design ensures that masks and wafers move accurately, patterns are projected accurately, and temperature is kept constant. Ultimately, this mask aligner provides the precision needed for the fabrication of advanced semiconductor devices.