Used SVG / PERKIN ELMER / ASML 661 #9107715 for sale
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SVG / PERKIN ELMER / ASML 661 mask aligner is a tool used to precisely align patterns on thin film layers with high accuracy. It is mainly used for photolithography processes in the semiconductor industry. SVG 661 has a high-resolution stepper motor and a built-in tool positioning system, allowing for precise pattern alignment down to sub-micron levels. ASML 661 has a robust frame and a stable base, making it highly accurate in precision alignment of patterns onto films. With its ability to reach arbitrary levels of pattern frequency, 661 is well suited for high-level nanofabrication. With high repeatability, PERKIN ELMER 661 is also suitable for producing multiple patterns on a single film. SVG / PERKIN ELMER / ASML 661 uses an optical viewfinder to align the pattern. It has a built-in translation stage, which allows for precise and repeatable movement across the pattern to be aligned. The mask aligner also has a Z-axis for depth adjustment. The stage can be precisely configured to have reach extremely low profile levels when necessary. Additionally, SVG 661 has an edge-sealing system, which ensures a tight seal between the film and the substrate, as well as providing a strong adhesive bond. ASML 661 is equipped with a modular, low-maintenance design, making it easy to use with minimal downtime. It is also designed with safety in mind with features like ground fault interrupters (GFIs) and emergency off-switches. Additionally, it has a high-sensitivity optical system that is ideal for inspections during operations. Overall, SVG Mask Aligner 661 is a versatile alignment tool that is perfect for precise, repeatable alignment processes in the semiconductor industry. Its features make it ideal for creating precise nanofabrication patterns and its modular design makes it reliable and easy to use. Additionally, its safety features ensure protection when working with the device. As such, ASML Mask Aligner PERKIN ELMER 661 is a great tool for a variety of applications.
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