Used SVG / PERKIN ELMER / ASML Micralign 700 #293619654 for sale

SVG / PERKIN ELMER / ASML Micralign 700 is a mask aligner - a machine used for the precise placement and alignment of lithographic reticles during the production of microelectronic devices. SVG Micralign 700 is a versatile tool that can align masks of various dimensions and features in semiconductor wafers, allowing for precise positioning and alignment of circuit patterns. The machine comprises of a camera equipment for scanning the reticle and the wafer, a bilinear alignment system, a 6-axis robot for precise positioning and alignment of the reticle with respect to the wafer, and an autofocus unit for high accuracy and repeatability of scan operations. The 6-axis robot allows for the manual arrangement of lithography reticles in three mutually perpendicular directions: X-Y-Z. ASML Micralign 700 has two scanning heads, one for larger reticles up to 10-inch (25 cm), and one for smaller masks up to 4-inch (10 cm). The camera machine utilizes Blue Laser Diode (BLD) imaging technology to scan the reticles and the wafers accurately, providing superb SNR (>300) and a high rotation rate for the stage, up to 3 turns per second. The autofocus tool is based on a Multiple Exposure Algorithm (MEA) and utilizes a Z-axis scanning asset to measure residual image distortions quickly and accurately. This allows for the accurate placement and alignment of the reticles with respect to the wafer, with a placement repeatability of < 5 nanometers. Micralign 700 also has an optional Hydraulic Chuck Model (HCS), which is designed to secure the wafer in place during alignment operations, providing a level of stability that is essential for accurate alignment of the mask with respect to the wafer. The HCS offers an adjustable, tool-free solution for securing the wafer in place without the need for additional tools. PERKIN ELMER Micralign 700 is a robust and versatile tool that allows for the accurate and repeatable alignment of reticles with respect to the wafer. The machine's highly accurate BLD camera equipment and MEA autofocus system ensures superb precision in scanning operations, while the optional HCS ensures that the wafer remains fixed and secure during alignment operations. With a placement repeatability of < 5 nanometers, SVG / PERKIN ELMER / ASML Micralign 700 is an indispensable tool for the fabrication of sophisticated microelectronic components.