Used SVG / PERKIN ELMER / ASML Micralign 700 #9238309 for sale

ID: 9238309
Wafer Size: 5"
Projection mask alignment system, 5" PERKIN ELMER 651 / 551 HT Auto Fine Alignment (AFA) Pre-alignment system Depth of focus: ± 6 Microns for 1.5 Micron wide lines and spaces (UV-4) Distortion plus magnification tolerance: ± 0.25 Micron Manual alignment: ± 0.25 Micron, 98% of data population Automatic alignment and magnification compensation: ± 0.25 Micron range, 98% of data population Uniformity of illumination: ± 3.0 % or <2 % for 2" and 4" Throughput rate: ≥ 100 Wafers per hour (UV-40, OEM Spec.) Resolution: At 320nm - 440nm (UV- 4) 1.25 Micron wide lines and spaces At 300nm - 350nm (UV- 3) 1.00 Micron wide lines and spaces At 420nm - 280nm (UV- 2) 0.90 Micron wide lines and spaces Overlay machine to machine: ± 0.30 Micron, 98% of data population With automatic alignment and magnification compensation operating Spectral range: 240 nm Through visible with standard secondary Mini-mag system Pick and place autoload (PAL) High reliable mod 600 pre-aligner assy PCE Mask carrier PCE Cassette for test mask HT Condenser Manual included Automatic fine alignment kit.
SVG / PERKIN ELMER / ASML Micralign 700 is a wafer-to-mask aligner technology that provides excellent lithography capability for manufacturing advanced integrated circuits. It is a state-of-the-art, high-precision alignment equipment that ensures the accuracy and quality of every process. The system features two independently-controllable stages: the x-y stage and the z-axis stage. The x-y stage is a high-precision θ/Φ stage with a digitally encoded, high resolution positioning unit that provides accurate, repeatable alignment of the wafer and the reticle. The z-axis stage provides a variable-precision machine to ensure that the nodal point distance between the reticle and wafer remains consistent during all alignments. The microscope optics are designed for high numerical aperture, providing superior resolution for precise alignment. The scanner tool design also provides a highly stable optical asset for accurate, repeatable alignment times. The scanner and the x-y stages are combined in a single unit, resulting in a compact footprint that offers improved stability and uniform irradiance. The model includes a sophisticated, high speed alignment computer that maintains the equipment speeds at a constant high speed operation, ensures accuracy and stability, and verifies alignment accuracy. The system also has an embedded wafer surface inspection unit that checks for any anomalies and defects that may affect the quality of the alignment. The software is user-friendly and intuitive, allowing users to quickly program and monitor the alignment process. Additional features include camera and imaging capability for critical device inspections and process adjustments. SVG Micralign 700 is an ideal tool for semiconductor manufacturers, providing best-in-class alignment accuracy and precision for any process step. It is a must-have technology for high-volume production of state-of-the-art integrated circuits.
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