Used ACCRETECH / TSK Win-Win 50-1600 #9257400 for sale

ACCRETECH / TSK Win-Win 50-1600 Mask & Wafer Inspection Equipment is a semi-automated inspection system designed for inspecting microelectronic components on a wafer. The unit features a 25 micrometer resolution optical microscope paired with a CCD camera that is capable of capturing wafer images with crisp precision. The microscope is mounted onto an XYZ stage, providing precise 3-axis manual movement of the sample to effectively inspect all desired areas. TSK Win-Win 50-1600 can also be equipped with integrated technologies such as a 4-axis auto stage controller, an automated stage positioning machine and autofocus, which enables the operator to program inspection pathways and to accurately move the image over the sample target. ACCRETECH Win-Win 50-1600 features advanced image-processing functions to accurately detect defects, edge alignment, registration errors and pattern continuity. The tool can be used to inspect various types of patterns including line, space, contact hole, via hole and overlay structures. It provides powerful features such as true color imaging, background illumination subtraction, advanced noise removal algorithms, color pattern extraction and shadow-mapping. All these features combine to deliver reliable and precise results. The asset can be integrated with third party evaluation software packages such as Silicon Vision, EAGLE and Xtreme. This allows the model to provide an automated defect classification and vector matching capabilities for enhanced wafer control and analysis. Furthermore, Win-Win 50-1600 features a user-friendly graphical interface that allows for quick sample setup and inspection start-up. Additionally, the equipment also comes with unique features such as Gigglebot control and wafer mapping that allow for easy sample manipulation and setup. ACCRETECH / TSK Win-Win 50-1600 is a reliable and efficient solution for inspecting a wide variety of microelectronic components on wafers. With its intuitive user interface, advanced image-processing technologies and compatibility with third-party software, the system enables efficient and high-precision defect detection and analysis.