Used AMAT / APPLIED MATERIALS SemVision CX DR-300 #9280347 for sale
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ID: 9280347
Wafer Size: 12"
Defect review system, 12"
Wafer shape: Notch
Electron optical system:
Accelerating voltage: 150 V - 15,000 V
Probe current: 10 pA - 1.2 pA
SEM Resolution: 4 nm at 1 kV
Magnification: 200x - 200,000x
Maximum pixel: 1440
Multi perspective SEM imaging
VC model
Optical microscope system:
Bright light microscope
Dark field microscope
Optical microscope: 5x / 20x / 100x
SECS / GEM Communication interface:
Defect file format
Output file format
Host communication (SECS II / GEM /HSMS)
Wafer stage:
Stage accuracy: ±1.5 um
Unique die to die
Automatic defect review
Automatic defect classification
Automatic process inspection
No E-Chuck stage
Anti charge
Peripheral:
Port type 1 and 2: OCLP
With EDX
Tilt and rotation
Remote work station
Resolution target: Regular
Signal tower: Standard
EPDU
No FIB.
AMAT / APPLIED MATERIALS SemVision CX DR-300 is a piece of sophisticated mask & wafer inspection equipment. This device features cutting-edge optics and image processing technology to provide high-resolution, submicron imaging and detection capabilities. The DR-300 has a unique scanning platform which provides a consistently high signal-to-noise ratio for both 32nm and below nodes. It has an angled illumination system to enable off-axis imaging and multi-beams to enable an increase in sensitivity and throughput. Furthermore, the DR-300 offers unparalleled high-speed critical dimension imaging that can analyze structures faster and with more accuracy than ever before. The CX DR-300 supports a range of different imaging capabilities. It has direct beam imaging (DBI), a unique technology designed to reduce effects of reflections and aberrations and to give sharper imaging for challenging samples, such as those with narrow scatter angles or large heights. Additionally, it features off-axis lighting angles and multi-beam imaging. Multi-beam imaging is essentially an advanced combination of dark field imaging and through-focus imaging because it does not rely on contrast due to reflections, allowing the imaging of ultra-thin metallic structures with great accuracy. Finally, the CX DR-300 offers comprehensive defect inspection capabilities, with 2D and 3D image reconstruction, automated defect classification and enhanced auto classification capabilities, as well as via imaging for automatic via-size measurements. It has a built-in intelligent defect review capability, which enables easy review of review images and provides recommendation for further inquiry or further review. All of these features combine to make AMAT SemVision CX DR-300 an excellent mask & wafer inspection system for any industry where reliable and accurate imaging is essential. It delivers top-level performance and guaranteed accuracy of measurements, allowing for the highest levels of quality assurance. This piece of equipment is a must-have for any manufacturer looking to ensure efficient and reliable inspection processes.
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