Used AMAT / APPLIED MATERIALS SemVision G2 #9167173 for sale

AMAT / APPLIED MATERIALS SemVision G2 is a mask & wafer inspection equipment specifically designed for semiconductor industry, enabling to quickly and accurately verify all critical chip features prior to fabrication. Its advanced optics and imaging technology allow for enhanced throughput and increased yield of integrated circuit design with reduced number of defects and failures. AMAT SemVision G2 uses Quadrant Detector technology for imaging assurance and greater pattern recognition performance. The system's specialized optical array enables four-way scanning of mask patterns, allowing capture of all patterns from multiple angles. Its vector unit increases high resolution imaging of individual features to provide clear and detailed character recognition. Additionally, its high speed scanning enables quick detection and elimination of production defects. The machine is equipped with a dual chamber, Class 10000 cleanroom that is optimized for effective air showers and chamber air filtration. The air shower tool allows for ultrapure air to enter the device, reducing the risk of particle contamination. It also uses position-triggered air blasts to evacuate particles during processing and so facilitating high throughput. Moreover, the asset is designed to deliver maximum transparency level with its double window design, which is idealised for dynamic imaging response. APPLIED MATERIALS SemVision G2 integrates a high-sensitivity Camera that delivers fast data processing speeds and High Definition (HD) imaging with its model of high-performance Charge-Coupled Device (CCD) image sensors. The equipment is equipped with on board Software for efficient information management and for compatibility with Single or Multi-level processing. Additionally, its advanced operating system supports both full pattern and defect capture with enhanced traceability and trace conversion functions. In conclusion, SemVision G2 mask & wafer inspection unit is optimised to provide accurate and reliable imaging with efficient defect and failure detection for integrated circuit fabrication. It integrates advanced optics and imaging technologies that enable high-resolution images of multiple feature angles, position-triggered air blasts, high-sensitivity camera, CCD image sensors, software compatibility and traceability functions.