Used AMAT / APPLIED MATERIALS SemVision G3 FIB #9375215 for sale

AMAT / APPLIED MATERIALS SemVision G3 FIB is a mask and wafer inspection equipment designed to provide automated, rapid and non-destructive defect detection and analysis. The system uses a focused ion beam (FIB) to access features buried beneath the surface. The unit is based on electron beam interaction techniques, which have been adapted to wafers and masks. The FIB is directed towards areas of the sample where defects are suspected, and the machine then detects and characterizes them. The beam also serves to cross-section the local surface, so that the internal geometry of the defects can be studied. The SEM can detect a wide variety of defect types, including surface and sub-surface defects such as scratches, fractures, point defects, local compositional variations, and micron-scale particles. AMAT SemVision G3 FIB has been designed with a user-friendly interface to facilitate tool control. The asset includes a variety of stages, such as the sample mounting stage, working chamber stage, and irradiation stage. It also features an advanced imaging model, with a large sample chamber. The image acquiring and image analysis modules can be used to locate and analyze defects efficiently. In addition, the equipment supports various radiation sources, such as a standard Faraday cup, a CCD imaging system, and a combination of an ion energy spectrometer and an ion backscattering spectrometer. It also features an advanced image reconstruction unit to analyze various topographical, surface, and interface features. The machine's high-speed scanning capabilities, coupled with its precise control over beam current, enable fast and accurate defect detection and analysis. The imaging capability of the tool can capture high-resolution images from a variety of angles and views. This makes it ideal for use in process control and failure analysis. APPLIED MATERIALS SemVision G3 FIB is a powerful inspection asset that can provide fast and accurate results with minimal effort. The sophisticated imaging model allows for the accurate and reliable detection and characterization of sub-surface and surface-level defects. The user-friendly interface and hardware capabilities make it easy to use, and its high-speed scanning capabilities enable highly efficient defect detection and analysis.