Used AMAT / APPLIED MATERIALS SemVision G3 #9192496 for sale

AMAT / APPLIED MATERIALS SemVision G3 is a next generation mask and wafer inspection equipment specifically designed to reduce critical defect review time and improve overall patterning accuracy. It is ideal for lithography applications in semiconductor device manufacturing and wafer fabrication processes. The system enables the detection of extreme tight pattern defects that traditional optical lithography techniques struggle to detect. It uses advanced deep UV-Laser Step and Scan (LS&S) technology, which offers users the ability to inspect and detect defects down to the sub-8nm node level. This is achieved through a combination of sophisticated optics and powerful digital signal processing. The unit also features an automated metrology, imaging and pattern-matching functionality, which combines image acquisition and analysis, digital pattern-matching, and user-defined pattern analysis, into one unified machine. By using this functionality, users are able to make faster and more accurate decisions when it comes to process and yield management. Additionally, AMAT SemVision G3 features an advanced tape-out verification tool. This feature enables the asset to inspect both every layer and component on a chip prior to going to the foundry. It also includes an automated defect review model that helps users precisely identify, mark, and classify die-level defects quickly and accurately. It also includes an advanced OCD (Optical Electron Correlation) engine, which eliminates false positive defects. The equipment offers an ergonomic design, which allows operators to work comfortably and efficiently by reducing strains and fatigue. Moreover, high throughput and low total cost of ownership are important benefits of APPLIED MATERIALS SemVision G3 system. It also requires minimal operator training and offers easy integration into existing production lines. Overall, SemVision G3 unit is a powerful, advanced, and efficient mask and wafer inspection machine. It offers users the ability to detect defects up to the sub-8nm node level with accuracy and reliability, as well as improved process and yield management solutions. The tool also provides improved cost-effectiveness, user comfort, and an easy integration into existing production lines, making it an ideal choice for lithography applications.