Used AMAT / APPLIED MATERIALS UVision 3 #293609484 for sale

AMAT / APPLIED MATERIALS UVision 3 Mask and Wafer Inspection Equipment is an automated optical inspection system designed for use in the Backend-of-Line (BEOL) semiconductor manufacturing process. The unit examines each Reticle and Wafer to detect errors in mask patterning, metrology and alignment. It can be used to evaluate Reticles and Wafers at several different stages of the BEOL process, including photomask fabrications, exposure of resist layers and etching processes. The machine is made up of several components, which work together to provide high-quality, high-resolution inspection of all features on the Reticle and Wafer simultaneously. One of the main components is the Beam Projector Tool, which houses the beam scanner and lens assembly, as well as a reticle substrate holder. This asset is designed to focus a visible light beam onto the Reticle or Wafer and accurately scan the entire surface, line by line. The beam is then reflected by the Reticle or Wafer back to the Beam Projector Model and analyzed. The next component is the Pattern Recognition Unit, which is used to analyze the data from the Beam Projector Equipment and detect errors and defects on the Reticle and Wafer. This unit uses advanced algorithms to detect defects that may not be visible to the naked eye. The software is also able to measure feature size, placement, and spacing to ensure that the Reticle and Wafer meet the specified requirements. The last component of AMAT UVision 3 Mask and Wafer Inspection System is the Display & Control Unit. This unit consists of a touchscreen display, which is used to control the unit and access product data. It also includes a built-in camera to view the reticle and wafer, and a printer so that reports can be printed directly from the unit. Overall, APPLIED MATERIALS UVision 3 Mask and Wafer Inspection Machine is a robust and reliable tool that has been designed to effectively inspect Reticles and Wafers during the BEOL process. It is capable of detecting defects that may be undetectable with the naked eye, and measurement of feature size, placement, and spacing, allowing for consistent accuracy and precision when it comes to inspecting Reticles and Wafers.