Used AMAT / APPLIED MATERIALS UVision 4 #9293623 for sale

AMAT / APPLIED MATERIALS UVision 4 Mask and Wafer Inspection equipment provides an industry-leading comprehensive solution for defect identification and characterization. The system offers high speed inspection of photomasks and wafers through the utilization of advanced high-power, ultraviolet (UV) laser detection technology. With the ability to detect and characterize defects down to 5 μm and the ability to detect cluster defects, AMAT UVision 4 enables the most comprehensive and accurate defect identification. APPLIED MATERIALS UVision 4 was developed to deliver the most efficient and reliable wafer and photomask inspections. Featuring a high-resolution laser slit scan and field of view (FOV), the unit enables users to quickly and accurately inspect the most difficult to detect defects from below the 5 μm level. In addition, UVision 4's advanced laser raster processing allows for unmatched sensitivity and uniform coverage with constant image intensification. AMAT / APPLIED MATERIALS UVision 4 also offers excellent defect characterization capability as well. Through the combination of laser specific detection algorithms and powerful Digital Image Processing, the machine is able to accurately characterize both 2-dimensional and 3-dimensional defects on the wafer and photomask. With the ability to distinguish between feature type, print density, and surface topography of the defect, the tool provides unparalleled characterization accuracy. In addition to defect characterization, AMAT UVision 4 offers a powerful software suite designed to manage and present the asset's data. Advanced software features such as Auto Defect Reconciliation, Defect Clustering, Defect Type Returns, Auto Adaptive Statistics, and Bulk Map Segmentation enable users to quickly analyze inspection results and identify potential sources of quality issues. APPLIED MATERIALS UVision 4 Mask and Wafer Inspection model is an industry-leading solution for identifying and characterizing defects ranging from 5 μm and lower. Utilizing high-resolution laser detection and powerful Digital Image Processing, UVision 4 can accurately detect and characterize both 2-dimensional and 3-dimensional defects on the wafer and photomask. With the ability to recognize defect type, print density, and surface topography, users can ensure that the highest quality product is being manufactured. The equipment is further supported by powerful imaging software, designed to assist users in quickly analyzing inspection results and identifying the sources of any quality issues.