Used AMAT / APPLIED MATERIALS WF 736 #9026245 for sale

AMAT / APPLIED MATERIALS WF 736 is an automated, top-down mask & wafer inspection equipment designed to perform comprehensive, accurate, and reliable inspection of advanced patterned wafers. This system can be integrated with customers' production platforms and workflows, meaning that it is capable of addressing the most stringent requirements for semiconductor, photovoltaic, and Radio Frequency (RF) devices. AMAT WF 736 utilizes high-resolution projection optics, automated measurement tools, and industry-leading image processing software to provide comprehensive wafer-level inspection results. This unit is capable of detecting the finest microfabricated features and critical defectivity issues such as particles, transitors, and shorts. The machine's high-resolution data analysis tools are designed to address a wide range of device- and process-specific challenges. APPLIED MATERIALS WF 736 utilizes patented, automated inspection algorithms to provide fast inspection rates with high accuracy. This tool is also equipped with advanced review and analysis tools, providing users with clear and accurate analysis and issue identification. Additionally, a combination of automated macro-inspection and image data interpretation capabilities allows this asset to identify and correct potential process and/or equipment problems before the wafers go to production. WF 736 supports a variety of structures and substrates, including multi-level structures, flip-chip components, and multiple thin layer metal stacks. The model features a modular, scalable design that is capable of addressing a variety of device sizes and production throughput requirements. Additionally, it also supports various programing modules and script-level commands for customized inspections for more specialized applications. AMAT / APPLIED MATERIALS WF 736 provides users with useful management and reporting tools, allowing for easy data review and analysis, corrective action planning, and part categorization. This equipment's technology provides advanced mask and wafer interrogation to ensure highest-level defect detection. The advanced image analysis and projection algorithms enable users to quickly identify and accurately locate die-to-die defects present at multiple layers of the device structure. Furthermore, the system's intuitive user interface ensures ease of use and unit customization for different applications.