Used ASM IBE 139 #293637824 for sale

ASM IBE 139 is a mask and wafer inspection equipment designed for high-volume semiconductor manufacturers. The system is based on a wafer mapping layout algorithm which enables it to map and inspect accurately many elements simultaneously, such as electrostatic discharge (ESD) tomography images, photomask defect inspection images, mapping of die-level locations, among others. The unit incorporates several novel features making it suitable for various applications such as high-volume production, defect analysis and fault localization. ASM IBE139 machine consists of two major components. The first component is the Interface Module, which includes an imaging camera, beam splitter, microscopes, a CPU and an image processing unit. This module is connected to the image-preprocessing DSP for the high-resolution imaging and defect detection on the wafer. The second component is the Imaging & Pattern Generation Module, which uses a custom proprietary software that controls the imaging and defect detection on the semiconductor wafer. The software uses a pattern recognition algorithm to rapidly classify defects between the monitoring steps and to identify any abnormalities. The software can also be used to perform advanced analytics on the images and to build detailed statistical reports. IBE 139 tool supports high-resolution imaging and can image up to 2,000 points per wafer. It uses infra-red and blue light sources, detecting defects in pixilated images. The asset is also equipped with high-resolution microscopes, allowing both 2D and 3D imaging and defect detection. Additionally, the stereo vision model is able to detect and process defects in three dimensions. In addition to imaging, the equipment offers various other features. It can identify, measure and characterize electrostatic discharge, photomask defect inspection, mapping of die-level locations, as well as hotspots, burn-in and other failure events. The system can also be used for encoding, tracing, masking and reconstituting a wafer's data. It supports SIMS analysis, which can be used for detailed characterization of the wafer's defects. Additionally, it can reproduce images in real-time, thus enabling online visual inspection for maximum accuracy. The unit also includes a library of standard images for comparison and has a fast learning algorithm to enable quick pattern recognition. Finally, the machine features a highly customizable user interface that allows users to configure its settings as required. It is beneficial for large volumes, guiding users to set the threshold and other inspection parameters to allow data to be quickly classified. Overall, IBE139 tool provides a comprehensive mask and wafer inspection solution. It offers high-resolution imaging capabilities and advanced pattern recognition capabilities to inspect and identify defects quickly and accurately. Furthermore, it has a customizable user interface, enabling users to adjust the asset's settings to suit their individual requirements.