Used ASM TIB 139 #9299366 for sale

ASM TIB 139 is a mask & wafer inspection equipment specially designed for the wafer dicing process. It is part of the Advanced Semiconductor Manufacturing (ASM) family of products. TIB 139 uses an advanced optical beam pattern technique to inspect the surface of a wafer to detect potential micro-defects. The system comprises of a specially designed large optical table, an image processing unit and a high-resolution camera. Furthermore, it supports an array of high-grade optics and software that facilitates a full-field inspection of a wafer's surface at different magnifications. The large optical table enables it to inspect up to a 10-micron area of a wafer's surface and its notable higher resolution of up to 50 nm can detect even the minutest defects on the surface. The camera included in the unit has a CCD resolution of 2048×1536 with a 2560X2048 dynamic range. It also contains a range of filters which are essential for enhancing image quality and enabling better analysis. In order to accommodate different wafer sizes, ASM TIB 139 also comes with interchangeable loading trays. The software included in the machine enables advanced image analysis and support for precise measurements and calculations. It can detect abnormalities and irregularities by analyzing images at different angles and displaying corrective action instructions for the defects. This guarantees that the wafers meet the desired standards. TIB 139 tool is also highly reliable and can be used in high-volume production environments. It allows the production of superior quality wafers and helps in reducing wastage due to defective surface inspection. Its high-performance, reliable and user-friendly features make it an ideal choice for the wafer dicing process.