Used ASM TLB 139 #9362813 for sale

ASM TLB 139 is a versatile mask and wafer inspection equipment designed for automatic, high-speed pattern geometry, defect characterisation and metal analysis of both mask and wafer surfaces. This system is capable of producing a complete profile of defect characteristics, from single-point to linear defects, and for both 2D and 3D pattern geometries. TLB 139 also provides a wide range of automated features for pattern analysis, including dedicated software packages for mask and reticle inspection, pattern structure analysis, CD/OCD measurement, and ripple analysis to name a few. The main body of ASM TLB 139 utilizes the latest high-accuracy optics technology in combination with a high-resolution, two-stage charge-coupled device (CCD) camera to enable an extremely high level of detail and precision in both the resolution and magnification capabilities of each inspection. The selection of the appropriate magnification and focus levels for each feature is achieved through the use of a state-of-the-art 5-axis motorized stage unit. This process allows for the optimal quality and accuracy of each inspection feature. TLB 139 is also outfitted with an automated defect recognition machine, capable of accurate automated classification of both dim and strong defects and hotspots. This automated capability includes a wide range of feature descriptors, such as curvature, contrast, symmetry, and size. Using these descriptors, the tool is capable of distinguishing and characterising both periodic defects in existing structure, as well as evaluating the presence of shifts, misalignments, and broken patterns. ASM TLB 139 also includes a comprehensive database asset for both pre-defined parameters and custom user-defined settings. All parameters are configured and stored in the model's memory, with a comprehensive selection of preset modes to automate mask and wafer inspections. This equipment also allows for the accurate and reliable inspection of different types of metal layers, such as gold, aluminum, and copper, in both exposed and covered areas of the mask or wafer, with full mask-or-wafer data analysis and reporting capabilities. Overall, TLB 139 is an incredibly versatile mask and wafer inspection system, equipped with the latest high accuracy optics and advanced automated features to enable smooth and reliable inspections of both basic and complex features. With its powerful and user-friendly features, ASM TLB 139 provides an efficient and comprehensive solution for high-speed pattern inspection and defect characterization.