Used ASML / HMI eP3 #293637176 for sale

ASML / HMI eP3 is a next-generation mask and wafer inspection equipment designed to detect the presence of defects on silicon wafers and printed circuit boards. This sophisticated and advanced equipment uses optical imaging and passes a light beam through the wafer or circuit board to identify microscopic and mechanical defects. Defects can be identified before they cause process or yield losses. HMI eP3 is built with a high-resolution optical imaging device and an ultraviolet excitation laser. An automated high-resolution digital imaging system provides a view of every micro-feature on the wafer and circuit board. The ultraviolet excitation laser used in the imaging process produces ultraviolet illumination with high accuracy. This illumination allows for the accurate detection of defects and imperfections on both wafers and circuit boards. ASML eP3 is also equipped with a special defect classification and analysis unit, which use advanced algorithms to identify, classify and analyze tiny defects on the silicon wafers. This machine allows for fast, reliable and efficient assessment and measurement of both the severity and consequences of a given defect. In addition, the tool includes auto-focus and auto-spot systems that enable rapid measurements with pinpoint accuracy. These systems allow for inspection of wafers and circuit boards that are larger and more complex. EP3 is equipped with an intelligent software asset which enables dynamic control of the optical excitation laser beam and the auto-focus model to ensure the highest possible precision throughout the inspection process. ASML / HMI eP3 allows users to access comprehensive details on every inspected wafer or circuit board. The comprehensive database stores information on over 3 million wafers, which ensures a high degree of accuracy and reliability during the inspection process. In summary, HMI eP3 is designed to provide our clients with a reliable and cost-effective solution for quickly and accurately detecting and assessing defects on silicon wafers and printed circuit boards. The equipment is equipped with an advanced optical imaging system, a defect classification and analysis unit, auto-focus and spot systems, and a comprehensive database, enabling it to process high volumes of data with exceptional accuracy.