Used BROWN & SHARPE 4.5.4 SF #9286760 for sale

BROWN & SHARPE 4.5.4 SF is an automated mask and wafer inspection equipment designed to quickly and accurately detect defects in production masks and wafers. It uses several techniques to rapidly inspect both sides of IC wafers and masks, including die-to-die, area-vector-mapping, double-sided stencil printing, and through-hole cross-section analysis. The system enables a single technician to perform several functions simultaneously, and can be easily adapted for different product requirements. The double-sided stencil printing functions of the unit automatically detect differences between the original designed pattern and the one stacked on an actual mask. This information is then used to perform a verification of the mask's physical characteristics. The machine uses a two-sided lamination of polyurethane along with an acrylic stain to form a uniform mask on the mask holder. Any defects that exist on the mask can then be identified. For wafer inspection, the tool utilizes area-vector mapping technology. This technology allows for automated mapping of die-to-die data on both sides of the wafer. Delineation of each side of the wafer is based on the mapping data and is used to predominantly detect defects on the wafer. The through-hole cross-section analysis functionality of the asset uses microscopic images to search for defects in the interconnect gaps between the wafer's contact fingers. A camera is used to scan each contact finger and measure the gap width to help detect tiny defects. BROWN & SHARPE 4.5.4 SF model is capable of performing wafer and mask inspections in a fraction of the time of traditional systems. It has been designed for quick setup and operation, allowing for a single technician to operate multiple functions at the same time. Additionally, the equipment is easily adjustable to accommodate various process requirements. This makes it ideal for those looking to save time and increase reliability when performing mask and wafer inspections.