Used BRUKER InSight 3D-DR #9293797 for sale

BRUKER InSight 3D-DR
ID: 9293797
Wafer Size: 12"
Vintage: 2017
Photomask inspection system, 12" 2017 vintage.
BRUKER InSight 3D-DR is a mask and wafer inspection equipment designed for in-line, non-destructive 3D analysis of integrated circuits. It utilizes a combination of optical and X-ray methods to measure the dimensional, topographic, and defect parameters of semiconductor patterns or samples with an accuracy of approximately 0.6 µm. The system is able to perform single and dual wafer inspections of a wide range of samples such as masks, wafers, and printed circuit boards. Its optics-based scanning technology has the ability to detect defects with high sensitivity and accuracy, even with extremely high feature density. It also provides comprehensive feedback on both the sidewall angles and transistor current leakage, enabling manufacturers and engineers to work with confidence. InSight 3D-DR features a powerful user interface that allows for quick, easy setup and instrument control. Through a series of scanning options, users can select the right parameters to measure objects based on their requirements. This can include measurements of feature size, planar angle, undercut, surface roughness, and more. The unit also features automated optimization of imaging parameters for different types of samples and defect detection to reduce false positives. In terms of imaging, the machine utilizes a range of high-resolution, solid-state digital cameras to inspect even the most intricate patterns. It can also be implemented with dynamic HDR imaging to capture images with both high contrast and unparalleled resolution. Data is written to an internal hard drive that can be accessed locally or remotely. Users can export images or data quickly and easily. The tool also allows for access to several popular file formats, including DXF and PDF, to ensure compatibility with existing systems. In conclusion, BRUKER InSight 3D-DR is an advanced, versatile solution for mask and wafer inspection that offers unrivalled precision, fast image acquisition, and automated optimization. Its ability to simultaneously inspect both single and dual wafers makes it an ideal choice for large-scale projects that require quick turnaround and accurate results.
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