Used HERMES MICROVISION / HMI eP3 XP #9389782 for sale

HERMES MICROVISION / HMI eP3 XP equipment is a high-performance mask and wafer inspection system designed for dynamic and comprehensive post-processing analysis of device topography. The unit provides comprehensive lithography process control using real-time inspection and monitoring of defects and process variables throughout the wafer fabrication process. HMI eP3 XP offers a comprehensive set of advanced lithography tools such as inspection of mask and wafer topography, as well as alignment, focus, and measurement. The machine features high magnification for optically dense masks, as well as advanced reticles and fields of view for precise overlay measurements. It also provides high-speed image capture that can accurately capture images up to 90 frames per second without compromising performance. TheHERMES MICROVISIONHERMES MICROVISION eP3 XP features a novel inspection tool that makes use of charge coupled device (CCD) imaging and laser scanning to obtain accurate and consistent measurements. The highly reliable and efficient design of the asset means that the results are repeatable and can be trusted even in challenging environments. The model also includes a range of tools such as auto-zoom, feature finder, and pattern recognition, which are used to quickly identify problems and suggest solutions. Moreover, eP3 XP allows for defect analysis and overlay measurements on a scanned wafer pattern. The equipment allows for automated wafer pattern inspection, including both surface and volume scans. The pattern analysis module combines scanning images with CAD data to detect potential defects and enable the correction of issues before they become visible on the circuit. Finally, the system offers a robust measurement console that can process a vast amount of data and offers enhanced noise reduction algorithms and image analysis tools. In conclusion, HERMES MICROVISION / HMI eP3 XP is a powerful mask and wafer inspection unit that provides powerful lithography process inspection and control. The machine offers advanced optics and imaging capabilities, as well as automated analysis and data processing capabilities, to accurately and reliably measure wafer topography and detect and correct potential defects.