Used HMI eScan 315 #9227591 for sale

HMI eScan 315 is a mask and wafer inspection equipment with the advanced technology to provide users with comprehensive visual and dimensional review of mask and wafer patterns. EScan 315 features an automated alignment stage, a fixed mask stage, a scanning stage, and a high-intensity illumination system based on programmable LED arrays. It is equipped with a full range of features to provide accurate measurement and efficient defect review. The automated alignment stage uses piezoelectric motion and image registration to achieve critical all-over alignment of the mask or wafer in the field of view. The accuracy of these measurements is assured with the high-resolution CMOS image sensor providing clear image data with a maximum resolution of up to 26 megapixels. The fixed mask stage is equipped with a dedicated motorized mask translation unit to allow for precise administration of multiple masking operations. It enables fast inspection of feature dimensions and shapes for higher-level defects using a highly accurate automatic image stitching feature. The scanning stage is equipped with an advanced stage that offers superior X-Y translation and variable speed rotation for true 3-dimensional inspection capability. It provides a precise platform for unparalleled X-Y and angular resolution for mask or wafer feature dimensions and shapes. The high-intensity illumination machine is designed to generate single or multiple wavelengths of light, allowing for a wide range of inspection modes. It features programmable LED array illumination with a spectral power density optimized for the best possible inspection result. The feature set for HMI eScan 315 is further augmented with a host of analysis tools designed to allow underlying structures to be revealed and accurately measured for speedy defect review. The tools include RARE image sharpening, false color mapping, contrast improvement and edge/lines analysis. Overall, eScan 315 is an advanced state-of-the-art tool for automated mask and wafer inspection. It is equipped with advanced technology and features for automated alignment, scanning, illumination and analysis, providing users with the capability to achieve highly accurate defect identification.