Used HONEYWELL / MICROTRAC UPA 150 #9260439 for sale

ID: 9260439
Vintage: 2000
Particle measurement system 2000 vintage.
HONEYWELL / MICROTRAC UPA 150 is an innovative mask and wafer inspection equipment that provides ultra-precise, non-destructive determination of the physical characteristics of mask and wafer components. This system is suitable for die bond, laser-scribing and thermal-scribing applications, offering superior levels of resolution and accuracy. HONEYWELL UPA 150 unit has several features that contribute to its enhanced precision and accuracy. It is equipped with an advanced optical imaging device that uses sophisticated algorithms to detect and identify particles, defects, and impurities. Its proprietary Adaptive Measurement Machine further contributes to its accuracy, allowing for measurements up to 20× resolution. In addition, this device has a scan-on-request control tool, which enables the user to trigger inspection cycles manually. To ensure high-quality measurements, MICROTRAC UPA 150 asset is also outfitted with a automated calibration and deterioration monitoring model. This ensures that the equipment is working properly and performing accurate measurements at all times. Additionally, the device's integrated wafer and component handling systems provide reliable, repeatable results with minimal operator intervention. In addition to its precision calibrations, UPA 150 system also offers several connectivity and expansion options. It is equipped with a 3GB Ethernet port, multiple USB and serial I/O ports, and a network compatible printer port. Furthermore, this unit is compatible with all major industrial printers, allowing for the quicker and more efficient production of detailed reports and graphs. HONEYWELL / MICROTRAC UPA 150 machine offers precise, accurate, and reliable mask and wafer evaluation and inspection capabilities. Its multiple connectivity options offer added convenience and ease of use, while its sophisticated measurement systems and automated calibration make it an ideal solution for demanding applications. Combined, these features enable the device to produce reliable results and facilitate efficient and accurate die bond, laser-scribing, and thermal-scribing processes.
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