Used HYPERNEX XRD #9311079 for sale

HYPERNEX XRD is an advanced mask and wafer inspection equipment designed to examine and analyze defects with extreme accuracy. The system uses the latest in automated optical inspection (AOI) technology to inspect and measure defects in extreme ultraviolet (EUV) lithography masks, film and wafer patterned features. By utilizing automated optical inspection, XRD is capable of inspecting features no larger than 50 nm in size, with a high level of accuracy and speed. HYPERNEX XRD utilizes an optical imaging unit with an extremely high resolution, in order to perform an examination of even the tiniest features. It is equipped with an adaptive, multi-aperture imaging machine, an unparalleled optical resolution, and an unparalleled 5 nm overlay accuracy, as well as an ultra-high-speed Reticle Scanning mode. XRD is engineered with an exceptional built-in software package called [TMP_NAME], where it is able to measure a wide range of critical items such as patterns, defect sizes, depth, side bridging (SB), line edge roughness (LER), bridge corners, line width variations, and defect clusters. With its fully automated in-line gauge, it is capable of providing high-precision registration and placement data, with a 0.1 um accuracy. Furthermore, the tool is designed to quickly analyze a large number of measurement data with high accuracy and stability. The asset has a user-friendly graphical interface, a powerful data management model, and support for multiple languages. In addition, it offers USB and network connection for data transfer, as well as standard Ethernet and RS232/RS485 connections for remote control. Furthermore, the equipment also has the capability of controlling the image exposure level to optimize both the defect inspection and overlay accuracy, ensuring precise measurements regardless of sample variation and environmental changes. Overall, HYPERNEX XRD is an advanced inspection and analysis capability that provides unsurpassed results and improved quality control. It is designed to ensure extreme accuracy for mask and wafer feature inspection on features sizes ranging from 50 nm and below. It is ideal for semiconductor manufacturing and offers a high degree of flexibility, cost effectiveness and reliability.