Used IRVINE OPTICAL Ultraspec III #39811 for sale

IRVINE OPTICAL Ultraspec III
ID: 39811
Wafer inspection station NIKON Optiphot DIC Optics Isolation table.
IRVINE OPTICAL Ultraspec III is a mask and wafer inspection equipment designed for use in production and research and development laboratories. It utilizes advanced optics and three-dimensional imaging technologies to provide efficient and high-quality inspection results. The system is well suited for testing a variety of wafer substrates, including photomasks, displays, CMOS devices, and other integrated circuits. Ultraspec III utilizes a few components to maximize efficiency and performance. Its automated wafer handler uses a motorized platform to rotate and position the substrate for optimal inspection. High-resolution lenses capture images of the substrate, providing detailed and reveal images. IRVINE OPTICAL Ultraspec III is also equipped with advanced image analysis software. It is capable of capturing both static and dynamic images, allowing users to rapidly analyze samples. It has a built in algorithm which can automatically identify defects and mark them on the image. The software also includes comprehensive data management capabilities, allowing users to store images, analysis information, and other data. In addition, Ultraspec III offers an integrated unit-level test port. This port is used to extend the machine to other test environments, such as a prober. This port also allows users to easily integrate additional inspection tasks into the overall tool operation. IRVINE OPTICAL Ultraspec III provides a user-friendly interface to control the asset. Its easy-to-use menu-driven menu model makes it a breeze to access all equipment functions. Additionally, all adjusts and parameters are stored in non-volatile memory, so users can bring the system up and running quickly. Ultraspec III is ideal for a variety of mask and wafer production applications. Its advanced optics and imaging technologies provide a reliable and accurate inspection process for applications such as gap, overlay and critical dimensions inspections. In addition, its integrated unit-level test port and user-friendly interface make it a great choice for rapid prototyping and testing of new wafers and substrates.
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