Used KEM / KOKUSAI VR-70 #9157351 for sale

KEM / KOKUSAI VR-70 is a high-performance mask and wafer inspection equipment that is designed for the inspection of photomasks and wafers. It performs multiple inspections, including optical inspection, defect classification, defect count, printing, flatness, die surface, and wafer flatness measurement. The system uses an advanced high-resolution image formation unit to acquire real-time images of photomask or wafer surfaces with excellent repeatability and accuracy. The acquired images are then processed by an ultra-high-speed laser imaging machine and a fast die-level inspection algorithm for defect locations and classification. KEM VR-70 provides a high-speed inspection speed, with a throughput of 3,000 wafers/hour. The tool uses a beamforming technology with a wavelength of 532nm to acquire images at a frame rate of up to 250 frames/second, and an image quality resolution of up to 75nm. The acquired images are then subjected to an advanced wafer surface analysis for defect detection, classification, and count. It can detect and classify defects, such as faults, patterns, and printing errors, with high accuracy and reliability. In addition, KOKUSAI VR-70 asset provides an automated and user-friendly operator interface, which enables the user to efficiently set up measurements, analyze results and confirm quality. The model also features a linear diffraction Grating Scanning Equipment (LDSS) which provides stable, high-resolution and reliable wafer flatness measurement from various print sizes. The system is capable of providing accurate surface vibration and tilt measurement to meet the stringent requirements for surface topology. In summary, VR-70 is an advanced mask and wafer inspection unit that provides high performance, accuracy, and reliability for the inspection of photomask and wafer surfaces. It is equipped with an advanced high-resolution image formation machine, ultra-high-speed laser imaging tool, and die-level inspection algorithms which enable the asset to quickly and accurately detect, classify, and count defects on the wafer surface. The model also features an automated and user-friendly operator interface as well as a linear diffraction Grating Scanning Equipment (LDSS) for accurate surface topology measurement.