Used KLA / ICOS CI 9450 #9253654 for sale

KLA / ICOS CI 9450 is a mask & wafer inspection system that is capable of visualizing individual dies on a wafer and providing automated, in-line inspection and metrology. It is equipped with advanced imaging technology and numerous imaging modes, such as brightfield, darkfield, and fluorescence, that help to detect defects on the wafer, even at the sub-micron level. KLA CI 9450 provides users with enhanced throughput and defect detection sensitivity, which further enables rapid production. The system offers multiple motion and alignment technologies, such as advanced vision inspection, laser displacement, automatic die recognition, and micron level fiducial alignment. Each technology provides detailed information on the die's image quality, including measurements on yield-critical features using automated image-processing algorithms, such as particle analysis and lithography background enhancement. In addition, ICOS CI-9450 comes with several efficiency-enhancing features, such as the Automatic Defect Detection Data Analysis Toolset, Quality Data Logger, Integrated Historical Viewer, and Image Viewer. The Automatic Defect Detection Data Analysis Toolset assists in the analysis of collected data. It features built-in formulas, chart views, and advanced statistics that are designed to simplify the process of sorting and interpreting results quickly and accurately. The Quality Data Logger is a feature that provides real-time insight into the quality of wafer inspection results. It produces clear, illustrative reports that help users understand the defect profile and quality improvement rate. The Integrated Historical Viewer and Image Viewer widgets allow users to browse and review the wafer inspection results in their entirety, providing a comprehensive view of wafer data history. In conclusion, CI 9450 mask & wafer inspection system delivers fast and accurate defect detection and yield analysis capabilities. It allows users to visualize individual dies on the wafer and identify defects at the sub-micron level. Its advanced imaging technologies, motion and alignment capabilities, and efficiency-enhancing features help users assess the quality of their wafers quickly and efficiently.