Used KLA / ICOS CI-T120 #9281542 for sale

KLA / ICOS CI-T120 is an advanced mask and wafer inspection equipment for semiconductor fabs. It features a distributed architecture made of four components: image capturing/processing, image analysis, system control, and data storage. The image capturing/processing component contains a custom-made high-resolution CCD camera unit for capturing images of the masks and the wafers. The sensor has a total of more than 2 million pixels and can capture images with a maximum resolution of 10 microns. Additionally, the machine contains sophisticated image processing hardware and software modules able to detect and classify defects. The image analysis component features dedicated hardware and software systems for the analysis of the captured images. The tool uses sophisticated algorithms to detect defects and classify them according to various characteristics such as shape, size, contrast, and other parameters. Additionally, the asset can perform e-beam, x-ray, and other forms of particle beam inspections to identify mask and wafer defects. The model control component is the heart of KLA CI T120 and is responsible for the smooth operation of the equipment. It contains a fully-programmable computer board for controlling the image capture, analysis and data storage. Additionally, it controls the system's parameters and calibrations, including the selection of the exposure time and the frequency of the analysis. The unit control also provides interfaces for direct communication with other systems in the fab. Finally, the data storage component is designed to store all the data of the inspected masks and wafers. It stores both the raw data from the image capture and processing, as well as the output of the analysis from the image analysis component. Additionally, it features a database machine for storing test results, maintenance log, and other relevant information related to the tool's operation. Overall, ICOS CI T-120 is an advanced mask and wafer inspection asset designed to meet the requirements of the semiconductor fabs. Its highly-customized hardware and software systems enable it to capture images with a resolution of 10 microns, detect and classify defects, as well as store all the collected data for further analysis and troubleshooting. Additionally, its distributed architecture ensures flexibility and scalability as well as compatibility with different fab setups.