Used KLA / ICOS CI-T130 #293670281 for sale

KLA / ICOS CI-T130 is a mask and wafer inspection equipment designed to deliver high throughput and precision for defect inspection applications. KLA CI-T130 combines proven wafer image acquisition technologies with advanced defect detection and classification algorithms, providing users with a powerful tool for manufacturing defect analysis. ICOS CI-T130 system is equipped with advanced optical imaging systems, utilizing RGB (red, green, and blue) light sources for maximum image clarity. This enables high-definition image capture of both 2D surface and 3D volume characteristics of wafers and test Windows with clarity and accuracy. Furthermore, CI-T130 boasts an automated aligner to ensure precise positioning of any mask or wafer, facilitating precise scanning and defect detection. KLA / ICOS CI-T130 facilities feature the most current image recognition techniques, allowing for fast and accurate identification of defects. This unit utilizes sophisticated defect classification algorithms, combined with pattern recognition capabilities, to identify, classify, and store a variety of defect types. KLA CI-T130 machine is further capable of providing detailed 3D case inspection and analysis of product defects. ICOS CI-T130 facilitates fast data sampling and processing, with an acquisition time of only 25 seconds for a 4" wafer. This impressive throughput rate enables users to quickly collect large amounts of data for downstream analysis with minimal downtime. Additionally, access to power-saving features, such as automatic sleep mode, means the tool requires minimal energy consumption when not in use. CI-T130 is an ideal solution for manufacturers aiming to achieve industry-leading defect detection performance. KLA / ICOS CI-T130 asset utilizes high-precision optics, advanced imaging technologies, and sophisticated analysis algorithms for maximum productivity and accuracy. This automated model offers superior performance both in its imaging capabilities as well as its defect analysis algorithms for unprecedented levels of defect analysis speed and accuracy.