Used KLA / ICOS CI-T130 #9304378 for sale

KLA / ICOS CI-T130 is a mask & wafer inspection equipment designed for inspecting semiconductor masks and wafers in the microelectronics industry. The system combines advanced image processing software with advanced optics, including a state-of-the-art line-scan camera and an optical profile sensor. This creates a powerful and automated inspection solution that delivers precise defect analysis and quick results. KLA CI-T130 utilizes a Visiononix Falcon 5V4 electron beam inspection unit to provide full 3D surface analysis with both top down and side-view metrology. Its four projections and lens provide 0.35 micron resolution imaging of patterns as small as 0.2 micron without using filters. This enables the machine to detect the tiniest defects accurately. The tool is also equipped with a high speed, ultra sensitive line-scan camera. This camera has a resolution of 3.5 micron for defect detection, and can capture both large and small structures with excellent image clarity. The optical profile sensor measures the depth of features such as contact holes, or detects raised, protruding or undercut features on the wafer or mask surface. Apart from inspection capabilities, ICOS CI-T130 offers functionality for data comparison, defect analysis and yield analysis. It uses an integrated pattern matching algorithm for detecting and classifying yield critical defects. The inspection asset also provides a graphical interface for setting up inspections and viewing results. CI-T130 is designed for ease of use, with a user-friendly graphical user interface and intuitive workflow. It also supports multiple languages and features advanced graphics to assist in detailed simplification. It features an accurate stage positioning model, and can be extended with optional accessories for wet processing or special applications. In conclusion, KLA / ICOS CI-T130 is an advanced mask & wafer inspection equipment that combines sophisticated imaging and pattern matching algorithms with advanced optical and 3D imaging systems, for fast and precise imaging.