Used KLA / TENCOR 2131 #293749625 for sale

KLA / TENCOR 2131 is a mask & wafer inspection instrument. It is used for detecting defects on wafers and masks that are used in the fabrication of microelectronic devices. The equipment is designed to be robust and reliable, capable of inspecting both mask and wafer defects in a wide range of applications, including die-bonding, wirebond, and backside inspection. KLA 2131 utilises a high-resolution, multi-wavelength scanning electron microscopy (SEM) imaging system to detect defects on both masks and wafers. The unit features a patented Shielded Energy Assembly (SEA) lightshielding technology which provides the operator with a shielded environment to ensure all defects are accurately identified and inspected. The instrument is equipped with a high-powered 4kV electron beam to create high resolution images, making it ideal for detecting both large and small defects. TENCOR 2131 also utilises advanced defect detection algorithms and image analysis to contrast patterns on wafers and masks, allowing for the most accurate detection of various defects. The machine has the capability to detect defects such as opacifications, shorts, peeling, aberrations, voids, pinholes, and various other fault types. The tool can be used for a wide range of applications, including: Image Matching, Integrated Circuit Imaging, Advanced Pattern Recognition, and Photolithography. The instrument also has an automated wafer carrier asset, which allows for automated wafer inspection at high speeds. The wafer carrier model includes a wafer multiscope that can be programmed to detect defects in multiple regions simultaneously. The equipment also includes a monitor control module to control the instrument's functions and programs. 2131 is one of the most advanced mask & wafer inspection systems available, offering high-resolution images and defect detection capabilities. Its automated wafer carrier system provides the operator with a faster and more efficient process that can be completed with greater accuracy. The unit is suitable for a variety of applications, including die-bonding, wirebond, and backside inspection.