Used KLA / TENCOR 2132 #293749965 for sale

KLA / TENCOR 2132 is an advanced semiconductor inspection platform specifically designed for the mask and wafer fabrication industries. It provides enhanced analyses to facilitate better control of the fabrication process and to accelerate product development and yield improvement. The equipment consists of a multi-axis alignment system, high resolution measurement head, projection optics, image acquisition and processing unit, and a laser displacement sensor. The multi-axis alignment machine enables precise positioning of the wafer so that the captured image contains all the relevant data points required for inspection. The high resolution measurement head contains advanced optical components to acquire extremely detailed images from the inspection. The projection optics allows for increased field of view and optimized light distribution, which significantly improves signal-to-noise ratio. The laser displacement sensor is used for measuring height, tilt, and elevation of the wafer relative to the image sensor. It also provides rapid focusing for different wafer materials, thicknesses, and shapes. The image acquisition and processing tool of KLA 2132 is complex and powerful. It automatically determines the required AOI image size, image quality and resolution, which minimizes user interaction and guarantees reliable results. The powerful Image acquisition and processing asset contains specialized filters to detect defects with high accuracy, as well as other features such as sub-pixel part selection and automatic focusing, which contribute significantly to efficient defect detection and classification. TENCOR 2132 is capable of detecting, characterizing and classifying a variety of defect types with high accuracy. Its high-speed, high-resolution imaging capabilities help to detect a variety of unexpected defects. Its advanced microscope design and large depth of field allows for more critical inspections, which helps in addressing more challenging problems. Overall, 2132's powerful imaging model and robust functionality form the basis for reliable and faster mask and wafer inspection. Its extensive feature set and intelligent image processing capabilities enable rapid and accurate identification of defects. These capabilities, when combined with advanced motion control and ultra-precise alignment, enable the highest level of defect detection and also provide stability and reliability for high-quality production.