Used KLA / TENCOR 2132 #9101228 for sale

KLA / TENCOR 2132
ID: 9101228
Vintage: 1995
Wafer inspection system Array Mode: 0.62μm: 5 sec/cm2 0.39μm: 15 sec/cm2 0.25μm: 30 sec/cm2 Random Mode: 0.50μm: 1.5 sec/cm2 0.30μm 5 sec/cm2 0.20μm 15 sec/cm2 Minimum inspection feature size @ 0.25μm with DIE to DIE mode ±0.5℃ Defect Capture Rate: >90% on KLA Standard Wafer with >0.1% false rate in Random Mode ±0.2℃ 1995 vintage.
KLA / TENCOR 2132 is a mask and wafer inspection equipment designed to provide a comprehensive solution for semiconductor production. The system offers accurate and reliable defect detection and analysis. The unit features a variety of high-end automation and analysis capabilities. It uses brightfield, darkfield, RED-enhancement tri-level imaging to accurately scan and detect defects, and features advanced algorithms and statistical methods to precisely and accurately analyze defect trends. The machine can analyze die-to-die, die-to-mask, and chip-to-chip levels of defects, and can measure complex CD and overlay characteristics. In addition to defect inspection and analysis, the tool can be configured to perform advanced metrology as well. It offers a range of parameters for assessing and monitoring such as critical dimensions (CDs), line widths and film thicknesses. This provides a more comprehensive way of ensuring that a given production run is compliant with the necessary specifications. The asset is highly reliable and stable, and durability has been engineered into its design. The model features a wafer-alignment framework for beam scanning. It also contains versatile, on-the-fly wafer geometry identification capabilities, advanced focus equipment, and a motorized, high-precision stage. The system offers an easy-to-use user interface for low learning curve and unmatched repeatability and accuracy. It can also easilyet up specialized defect detection recipes for an extremely high level of customization to specific application requirements. The unit's mask & wafer inspection capabilities meet the most stringent requirements for quality assurance in the semiconductor fabrication industry. It is designed to deliver significant improvements in throughput, yield, and reliability.
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