Used KLA / TENCOR 2135 #9195908 for sale

KLA / TENCOR 2135 is a mask and wafer inspection equipment designed for modern semiconductor production. The system uses high-resolution imaging technology to accurately and quickly inspect masks and wafers used in the fabrication of semiconductor components. This unit is capable of detecting both surface defects, such as scratches and particulates, and subsurface defects, such as voids and pinholes. KLA 2135 consists of an optical column, which includes a light source, illumination optics, and lenses, along with an image analysis machine, which includes a scanning geometry, mechanical scanning stage, and image processing software. The optical column includes a brightfield brightfield illuminator, polarized brightfield illuminator, and oblique illuminator, all of which are necessary for detecting surface and subsurface defects at various depths. Additionally, the tool features a large field of view and a high numerical aperture. The image analysis asset of TENCOR 2135 is designed to analyze images at a high speed and with high accuracy. The image processing software is capable of detecting and classifying defects in real-time, enabling quick response times and high productivity. Additionally, the model features wafer inspection algorithms, which are designed to reduce the number of false alarms generated. 2135 is designed to be integrated into automated production lines, making it easy to integrate into existing facilities. Additionally, the equipment is capable of interfacing with other systems, such as yield management, process control, and track and trace systems. KLA / TENCOR 2135 also comes equipped with a user-friendly graphical user interface, allowing users to quickly and easily set up and use the system. KLA 2135 is an essential tool for modern semiconductor production, as it provides users with high-resolution imaging technology, image analysis capabilities, and integration with other systems. With TENCOR 2135, manufacturers are able to quickly and accurately detect surface and subsurface defects in masks and wafers, allowing for faster, more efficient production.