Used KLA / TENCOR 2135 #9373035 for sale

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ID: 9373035
Wafer inspection system.
KLA / TENCOR 2135 mask & wafer inspection equipment is a state-of-the-art imaging platform designed to maximize chip yield while improving productivity. It offers the highest image quality resolution and precision in comparison to any other imaging system in the market. KLA 2135 is equipped with a high-resolution digital imaging camera, capable of capturing up to 10 nanometer resolution images of mask and wafer patterns. This allows for the real-time inspection of patterns as small as circuits on a smartphone or wearables, as well as very large silicon wafers. This unit is truly "lights-out" capable and highly automated for maximum efficiency. TENCOR 2135 is equipped with a high-brightness white light source, which is optimized for a variety of defects detection. This allows the machine to detect image artifacts, such as diffractive defects, as well as traditional flat-patterned defects. Additionally, this tool also features a high-performance epi-fluorescence channel for non-contact surface inspection, enabling detection of random defects and local defects. The epi-fluorescence capability helps improve throughput of semiconductor device yield by detecting spots, tiny foreign particles, and surface etched areas - all of which can reduce device performance and yield. 2135 is designed for flexibility and scalability, with pre-configured inspection toolsets, an intuitive software platform, and multiple detector interface options. Its metrology capabilities make it the perfect fit for device characterization, as it can detect critical dimensions on a wafer without any physical marks, making it a valuable metrology tool. Finally, KLA / TENCOR 2135 can be custom-configured to fit customer's needs and its ease of use makes it ideal for 24/7 operation. As the industry leader in mask & wafer test systems, KLA is a reliable and cost-effective asset for semiconductor imaging and characterization. Using TENCOR innovative imaging technologies, users can realize improved yield and device performance, as well as high quality products. This model is ideal for a variety of semiconductor device applications and can be used in applications such as advanced packaging and MEMS.
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