Used KLA / TENCOR 2139 #9230528 for sale

KLA / TENCOR 2139 is a mask and wafer inspection equipment, designed to accurately measure and inspect throughout the fabrication process of mask and wafer components. It features fast, non-destructive wafer inspection with precision and repeatability, as well as unique capabilities like edge probing and fast defect characterization. At the heart of the system lies its advanced optical unit, enabling high-resolution wafer imaging up to 17µm with an area coverage rate of up to 50 wafers per hour. Its unique Dual Target CCD detector ensures fast, large field non-destructive imaging with optimized signal to noise performance, from a large selection of available imaging modes to accommodate a wide range of requirements. KLA 2139 offers accurate height measurement and automated defect characterization via three-way comparison, allowing users to quickly differentiate among specific defects. Its advanced control software further simplifies defect analysis by enabling simultaneous comparison of both 2D and 3D images taken at different angles through its Dual Reconstruction technology, allowing users to gain insight into both surface and subsurface attributes of the wafer's topography. The machine is also equipped with a unique off-axis viewing technology that can quickly detect defects in dual-side structures and multi-depth patterned films on low-k wafers used in memory device fabrication. This technology is especially suited for the characterization of contact etch stop layers (CESL) and gate oxide layers (GO) which are difficult to measure with off-axis techniques. TENCOR 2139 also includes options for automated or manual wafer handling, with configurations to process both sides of the wafer simultaneously or individually. The tool also features an automated and precise binning option that segregates good and defective wafers quickly and efficiently. In conclusion, 2139 offers superior imaging and analysis technology for mask and wafer inspection in a robust and highly configurable package, with some of the fastest inspection speeds available in the industry today. Its advanced imaging and defect characterization asset enables users to quickly and accurately determine the defects in their components and optimize their manufacturing processes.